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NTP5860NLG PDF预览

NTP5860NLG

更新时间: 2024-11-24 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 局域网开关脉冲晶体管
页数 文件大小 规格书
7页 122K
描述
功率 MOSFET,60V,169A,3mΩ,单 N 沟道,TO-220,逻辑电平

NTP5860NLG 技术参数

是否无铅: 不含铅生命周期:End Of Life
零件包装代码:TO-220AB包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.21
雪崩能效等级(Eas):735 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):220 A最大漏极电流 (ID):130 A
最大漏源导通电阻:0.0036 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):283 W最大脉冲漏极电流 (IDM):660 A
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTP5860NLG 数据手册

 浏览型号NTP5860NLG的Datasheet PDF文件第2页浏览型号NTP5860NLG的Datasheet PDF文件第3页浏览型号NTP5860NLG的Datasheet PDF文件第4页浏览型号NTP5860NLG的Datasheet PDF文件第5页浏览型号NTP5860NLG的Datasheet PDF文件第6页浏览型号NTP5860NLG的Datasheet PDF文件第7页 
NTB5860NL, NTP5860NL,  
NVB5860NL  
N-Channel Power MOSFET  
60 V, 220 A, 3.0 mW  
Features  
http://onsemi.com  
Low R  
DS(on)  
High Current Capability  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
100% Avalanche Tested  
These Devices are PbFree, Halogen Free and are RoHS Compliant  
3.0 mW @ 10 V  
3.6 mW @ 4.5 V  
60 V  
220 A  
NVB Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable  
D
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Symbol  
Value  
60  
Unit  
V
G
V
DSS  
V
GS  
$20  
220  
156  
283  
V
S
NCHANNEL MOSFET  
Continuous Drain  
Current, R  
Steady  
State  
T = 25°C  
I
D
A
A
q
JC  
T = 100°C  
A
4
Power Dissipation,  
R
Steady  
State  
T = 25°C  
A
P
D
W
q
JC  
4
Pulsed Drain Current  
t = 10 ms  
I
660  
130  
A
A
p
DM  
1
2
Current Limited by Package  
I
DMmax  
3
Operating and Storage Temperature Range  
T , T  
J
55 to  
+175  
°C  
stg  
2
TO220AB  
CASE 221A  
STYLE 5  
D PAK  
CASE 418B  
STYLE 2  
1
Source Current (Body Diode)  
I
S
130  
735  
A
2
3
Single Pulse DraintoSource Avalanche  
Energy (L = 0.3 mH)  
E
mJ  
AS  
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
Lead Temperature for Soldering  
Purposes (1/8from Case for 10 Seconds)  
T
260  
°C  
L
4
4
Drain  
Drain  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
0.53  
28  
Unit  
NTB  
5860NLG  
AYWW  
JunctiontoCase (Drain) Steady State  
JunctiontoAmbient Steady State (Note 1)  
R
°C/W  
q
JC  
NTP  
5860NLG  
AYWW  
R
q
JA  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
2
1
Gate  
3
1
Gate  
3
Drain  
Source  
Source  
2
(Cu Area 1.127 sq in [2 oz] including traces).  
Drain  
G
A
Y
= PbFree Device  
= Assembly Location  
= Year  
WW  
= Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
Augsut, 2012 Rev. 1  
NTB5860NL/D  
 

NTP5860NLG 替代型号

型号 品牌 替代类型 描述 数据表
NTP5860NG ONSEMI

完全替代

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