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NTD2406-1G PDF预览

NTD2406-1G

更新时间: 2024-11-03 01:17:23
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 126K
描述
Power MOSFET

NTD2406-1G 数据手册

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NTD24N06  
Power MOSFET  
60 V, 24 A, N−Channel DPAK/IPAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
Features  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
Pb−Free Packages are Available  
60 V  
32 mW  
24 A  
Typical Applications  
D
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
N−Channel  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
4
Rating  
Symbol Value  
Unit  
Vdc  
Vdc  
Vdc  
Drain−to−Source Voltage  
V
60  
60  
DSS  
DGR  
4
Drain−to−Gate Voltage (R = 10 MW)  
V
GS  
1
2
3
2
1
Gate−to−Source Voltage  
− Continuous  
3
V
V
20  
30  
GS  
GS  
− Non−repetitive (t v10 ms)  
DPAK  
CASE 369C  
(Surface Mount)  
STYLE 2  
IPAK  
p
CASE 369D  
(Straight Lead)  
STYLE 2  
Drain Current  
− Continuous @ T = 25°C, T = 150°C  
I
I
I
24  
27  
19  
80  
Adc  
Adc  
Adc  
Apk  
A
J
D
D
D
− Continuous @ T = 25°C, T = 175°C  
A
J
− Continuous @ T = 100°C, T = 175°C  
A
J
MARKING DIAGRAMS  
& PIN ASSIGNMENTS  
− Single Pulse (t v10 ms), T = 175°C  
I
p
J
DM  
Total Power Dissipation @ T = 25°C  
P
D
62.5  
0.42  
1.88  
1.36  
W
W/°C  
W
A
4
4
Derate above 25°C  
Total Power Dissipation @ T = 25°C (Note 1)  
Drain  
Drain  
A
Total Power Dissipation @ T = 25°C (Note 2)  
W
A
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
J
stg  
Single Pulse Drain−to−Source Avalanche  
E
AS  
162  
mJ  
Energy − Starting T = 25°C  
J
2
(V = 50 Vdc, V = 10 Vdc,  
DD  
GS  
1
Gate  
3
Drain  
L = 1.0 mH, I (pk) = 18 A, V = 60 Vdc)  
L
DS  
Source  
1
2
3
Thermal Resistance  
− Junction−to−Case  
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
°C/W  
°C  
Gate Drain Source  
R
R
R
2.4  
80  
110  
q
JC  
JA  
JA  
q
A
Y
= Assembly Location*  
q
= Year  
WW  
24N06  
G
= Work Week  
= Device Code  
= Pb−Free Package  
Maximum Lead Temperature for Soldering  
Purposes, 1/8 in from case for 10 seconds  
T
260  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.  
2. When surface mounted to an FR−4 board using the minimum recommended  
pad size.  
* The Assembly Location code (A) is front side  
optional. In cases where the Assembly Location is  
stamped in the package, the front side assembly  
code may be blank.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
September, 2014 − Rev. 5  
NTD24N06/D  
 

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