NTD24N06
Power MOSFET
60 V, 24 A, N−Channel DPAK/IPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
Features
V
R
TYP
I MAX
D
(BR)DSS
DS(on)
• Pb−Free Packages are Available
60 V
32 mW
24 A
Typical Applications
D
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
N−Channel
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
4
Rating
Symbol Value
Unit
Vdc
Vdc
Vdc
Drain−to−Source Voltage
V
60
60
DSS
DGR
4
Drain−to−Gate Voltage (R = 10 MW)
V
GS
1
2
3
2
1
Gate−to−Source Voltage
− Continuous
3
V
V
20
30
GS
GS
− Non−repetitive (t v10 ms)
DPAK
CASE 369C
(Surface Mount)
STYLE 2
IPAK
p
CASE 369D
(Straight Lead)
STYLE 2
Drain Current
− Continuous @ T = 25°C, T = 150°C
I
I
I
24
27
19
80
Adc
Adc
Adc
Apk
A
J
D
D
D
− Continuous @ T = 25°C, T = 175°C
A
J
− Continuous @ T = 100°C, T = 175°C
A
J
MARKING DIAGRAMS
& PIN ASSIGNMENTS
− Single Pulse (t v10 ms), T = 175°C
I
p
J
DM
Total Power Dissipation @ T = 25°C
P
D
62.5
0.42
1.88
1.36
W
W/°C
W
A
4
4
Derate above 25°C
Total Power Dissipation @ T = 25°C (Note 1)
Drain
Drain
A
Total Power Dissipation @ T = 25°C (Note 2)
W
A
Operating and Storage Temperature Range
T , T
−55 to
+175
°C
J
stg
Single Pulse Drain−to−Source Avalanche
E
AS
162
mJ
Energy − Starting T = 25°C
J
2
(V = 50 Vdc, V = 10 Vdc,
DD
GS
1
Gate
3
Drain
L = 1.0 mH, I (pk) = 18 A, V = 60 Vdc)
L
DS
Source
1
2
3
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
°C/W
°C
Gate Drain Source
R
R
R
2.4
80
110
q
JC
JA
JA
q
A
Y
= Assembly Location*
q
= Year
WW
24N06
G
= Work Week
= Device Code
= Pb−Free Package
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T
260
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.
2. When surface mounted to an FR−4 board using the minimum recommended
pad size.
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
September, 2014 − Rev. 5
NTD24N06/D