Datasheet > NTD2406-1G

NTD2406-1G

更新时间： 2024-09-24 01:17:23

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
8页	126K
描述
Power MOSFET

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

NTD2406-1G 数据手册

NTD24N06

Power MOSFET

60 V, 24 A, N−Channel DPAK/IPAK

Designed for low voltage, high speed switching applications in

power supplies, converters and power motor controls and bridge

circuits.

http://onsemi.com

Features

TYP

I MAX

(BR)DSS

DS(on)

• Pb−Free Packages are Available

60 V

32 mW

24 A

Typical Applications

• Power Supplies

• Converters

• Power Motor Controls

• Bridge Circuits

N−Channel

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Rating

Symbol Value

Unit

Vdc

Drain−to−Source Voltage

DSS

DGR

Drain−to−Gate Voltage (R = 10 MW)

Gate−to−Source Voltage

− Continuous

− Non−repetitive (t v10 ms)

DPAK

CASE 369C

(Surface Mount)

STYLE 2

IPAK

CASE 369D

(Straight Lead)

STYLE 2

Drain Current

− Continuous @ T = 25°C, T = 150°C

Adc

Apk

− Continuous @ T = 25°C, T = 175°C

− Continuous @ T = 100°C, T = 175°C

MARKING DIAGRAMS

& PIN ASSIGNMENTS

− Single Pulse (t v10 ms), T = 175°C

Total Power Dissipation @ T = 25°C

62.5

0.42

1.88

1.36

W/°C

Derate above 25°C

Total Power Dissipation @ T = 25°C (Note 1)

Drain

Total Power Dissipation @ T = 25°C (Note 2)

Operating and Storage Temperature Range

T , T

−55 to

+175

°C

stg

Single Pulse Drain−to−Source Avalanche

162

Energy − Starting T = 25°C

(V = 50 Vdc, V = 10 Vdc,

Gate

Drain

L = 1.0 mH, I (pk) = 18 A, V = 60 Vdc)

Source

Thermal Resistance

− Junction−to−Case

− Junction−to−Ambient (Note 1)

− Junction−to−Ambient (Note 2)

°C/W

°C

Gate Drain Source

2.4

110

= Assembly Location*

= Year

24N06

= Work Week

= Device Code

= Pb−Free Package

Maximum Lead Temperature for Soldering

Purposes, 1/8 in from case for 10 seconds

260

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.

2. When surface mounted to an FR−4 board using the minimum recommended

pad size.

* The Assembly Location code (A) is front side

optional. In cases where the Assembly Location is

stamped in the package, the front side assembly

code may be blank.

ORDERING INFORMATION

See detailed ordering and shipping information on page 2 of

this data sheet.

Publication Order Number:

September, 2014 − Rev. 5

NTD24N06/D

12 3 4 5 6 7 8

中文翻译

下载PDF

与NTD2406-1G相关器件

型号	品牌	获取价格	描述	数据表
NTD2410	CRYDOM	获取价格	THE GLOBAL EXPERT IN SOLID STATE RELAY TECHNOLOGY
NTD2410-10	CRYDOM	获取价格	Trigger Output SSR, 1-Channel, 3750V Isolation, ROHS COMPLIANT, PLASTIC PACKAGE-4
NTD2410E	CRYDOM	获取价格	Trigger Output SSR, 1-Channel, 3750V Isolation, PLASTIC PACKAGE-4
NTD2410E-10	CRYDOM	获取价格	Trigger Output SSR, 1-Channel, 3750V Isolation, PLASTIC PACKAGE-4
NTD2410EF	CRYDOM	获取价格	Solid State Relay
NTD2410F	CRYDOM	获取价格	Trigger Output SSR, 1-Channel, 3750V Isolation, PLASTIC PACKAGE-4
NTD2410F-10	CRYDOM	获取价格	Trigger Output SSR, 1-Channel, 3750V Isolation, ROHS COMPLIANT, PLASTIC PACKAGE-4
NTD2425	CRYDOM	获取价格	THE GLOBAL EXPERT IN SOLID STATE RELAY TECHNOLOGY
NTD2425-10	CRYDOM	获取价格	Trigger Output SSR, 1-Channel, 3750V Isolation, ROHS COMPLIANT, PLASTIC PACKAGE-4
NTD2425E	CRYDOM	获取价格	Trigger Output SSR, 1-Channel, 3750V Isolation, PLASTIC PACKAGE-4

与NTD2406-1G相关文章

SK海力士量产12层HBM3E，容量高达36GB
2024-09-27

4
意法半导体传感器驱动Sphere，开启沉浸式电影新时代
2024-09-27

6
摩尔斯微电子在美国约书亚树国家公园测试 Wi-Fi HaLow
2024-09-18

79
贸泽上架Tallysman TW5386智能GNSS天线
2024-09-18

69

产品中心

服务支持

精选活动

关于我们

帮助中心

NTD2406-1G

NTD2406-1G 数据手册

与NTD2406-1G相关器件

与NTD2406-1G相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

NTD2406-1G

NTD2406-1G 数据手册

与NTD2406-1G相关器件

与NTD2406-1G相关文章

您还可以找

您在本页遇到什么问题？