DATA SHEET
www.onsemi.com
COLLECTOR
General Purpose Transistor
PNP Silicon
3
1
NST3906MX2
BASE
Features
2
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
EMITTER
Compliant
3
MAXIMUM RATINGS
1
2
Rating
Symbol
Value
−40
Unit
Vdc
Collector−Emitter Voltage
Collector−Base Voltage
V
CEO
X2DFN3 (1.0 x 0.6 mm)
CASE 714AC
V
−40
Vdc
CBO
EBO
Emitter−Base Voltage
V
−5.0
−200
−800
Vdc
MARKING DIAGRAM
Collector Current − Continuous (Note 1)
Collector Current − Peak (Note 1)
I
C
mAdc
mAdc
I
CM
AF M
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
AF = Specific Device Code
M
= Date Code
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
ORDERING INFORMATION
Total Power Dissipation (Note 2)
P
D
@ T = 25°C
165
mW
A
†
Derate above 25°C
1.39
mW/°C
Device
NST3906MX2T5G
Package
Shipping
X2DFN3
Thermal Resistance,
Junction−to−Ambient (Note 2)
R
720
°C/W
8000 / Tape &
Reel
q
JA
(Pb−Free)
Total Power Dissipation (Note 3)
P
D
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
@ T = 25°C
590
mW
A
Derate above 25°C
4.93
mW/°C
Thermal Resistance,
Junction−to−Ambient (Note 3)
R
203
°C/W
q
JA
Junction and Storage Temperature Range
T , T
−55 to
+150
°C
J
stg
1. Reference SOA Curve
2
2
2. Surface−mounted on FR4 board using a 0.6 mm , 2 oz. Cu pad
3. Surface−mounted on FR4 board using a 100 mm , 2 oz. Cu pad
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
January, 2022 − Rev. 0
NST3906MX2/D