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NST4617MX2T5G PDF预览

NST4617MX2T5G

更新时间: 2023-09-03 20:39:08
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 110K
描述
100 mA, 50 V, NPN Bipolar Transistor in SOT-883

NST4617MX2T5G 数据手册

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DATA SHEET  
www.onsemi.com  
COLLECTOR  
NPN Silicon General  
Purpose Amplifier  
Transistor  
3
1
BASE  
NST4617MX2  
2
This NPN transistor is designed for general purpose amplifier  
applications. This device is housed in the X2DFN3 package which is  
designed for surface mount applications, where board space is at a  
premium.  
EMITTER  
3
Features  
1
2
High h , 280 (typical)  
Low V  
FE  
X2DFN3 (1.0x0.6)  
CASE 714AC  
, < 0.5 V  
CE(sat)  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant*  
MARKING DIAGRAM  
MAXIMUM RATINGS (T = 25°C)  
J
AG M  
Rating  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Symbol  
Value  
50  
Unit  
Vdc  
V
(BR)CBO  
(BR)CEO  
(BR)EBO  
AG = Specific Device Code  
V
V
50  
Vdc  
M
= Date Code  
5.0  
Vdc  
Collector Current Continuous  
I
100  
mAdc  
C
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
NST4617MX2T5G  
Package  
Shipping  
X2DFN3  
8000 / Tape &  
Reel  
(PbFree)  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Total Power Dissipation (Note 1)  
P
D
@ T = 25°C  
166  
1.39  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance,  
JunctiontoAmbient (Note 1)  
R
722  
°C/W  
q
JA  
Total Power Dissipation (Note 2)  
P
D
@ T = 25°C  
700  
5.99  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance,  
JunctiontoAmbient (Note 2)  
R
167  
°C/W  
q
JA  
Junction and Storage Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
2
2
1. Surfacemounted on FR4 board using a 0.6 mm , 2 oz. Cu pad  
2. Surfacemounted on FR4 board using a 100 mm , 2 oz. Cu pad  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
January, 2022 Rev. 0  
NST4617MX2/D  
 

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