MBR8H100MFS,
NRVB8H100MFS
Switch Mode
Power Rectifiers
Features
• Low Power Loss / High Efficiency
www.onsemi.com
• New Package Provides Capability of Inspection and Probe After
Board Mounting
SCHOTTKY BARRIER
RECTIFIERS
• Guardring for Stress Protection
• Low Forward Voltage Drop
8 AMPERES
100 VOLTS
• 175°C Operating Junction Temperature
• WF Suffix for Products with Wettable Flanks
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
5,6
1,2,3
• These are Pb−Free Devices
Mechanical Characteristics:
MARKING
DIAGRAM
• Case: Epoxy, Molded
A
C
C
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
1
B8H100
AYWZZ
A
A
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
Not Used
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
B8H100 = Specific Device Code
• Device Meets MSL 1 Requirements
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
RRM
V
RWM
V
100
8.0
R
ORDERING INFORMATION
Average Rectified Forward Current
I
A
A
F(AV)
†
Device
Package Shipping
(Rated V , T = 165°C)
R
C
MBR8H100MFST1G
SO−8 FL 1500 /
Peak Repetitive Forward Current,
I
16
75
FRM
(Pb−Free) Tape & Reel
SO−8 FL 5000 /
(Rated V , Square Wave,
R
20 kHz, T = 162°C)
C
MBR8H100MFST3G
NRVB8H100MFST1G
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
I
A
(Pb−Free) Tape & Reel
SO−8 FL 1500 /
(Pb−Free) Tape & Reel
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
NRVB8H100MFSWFT1G SO−8 FL 1500 /
(Pb−Free) Tape & Reel
FSM
NRVB8H100MFST3G
Storage Temperature Range
T
−65 to +175
−55 to +175
75
°C
°C
mJ
stg
Operating Junction Temperature
T
J
Unclamped Inductive Switching
Energy (10 mH Inductor,
Non−repetitive)
E
AS
NRVB8H100MFSWFT3G SO−8 FL
5000 /
ESD Rating (Human Body Model)
ESD Rating (Machine Model)
3B
(Pb−Free) Tape & Reel
M4
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
NOTE: The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RJA
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
August, 2015 − Rev. 2
MBR8H100MFS/D