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NRVBA1H100NT3G PDF预览

NRVBA1H100NT3G

更新时间： 2024-09-26 02:52:31
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管
页数 文件大小 规格书
6页 251K
描述
Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package

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中文翻译

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NRVBA1H100NT3G 技术参数

是否无铅： 不含铅生命周期：Active
包装说明：SMA, 2 PINReach Compliance Code：compliant
Factory Lead Time：43 weeks 1 day风险等级：5.67
其他特性：FREE WHEELING DIODE应用：GENERAL PURPOSE
配置：SINGLE二极管元件材料：SILICON
二极管类型：RECTIFIER DIODE最大正向电压 (VF)：0.84 V
JESD-30 代码：R-PDSO-J2最大非重复峰值正向电流：50 A
元件数量：1相数：1
端子数量：2最高工作温度：175 °C
最低工作温度：-65 °C最大输出电流：1 A
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE参考标准：AEC-Q101
最大重复峰值反向电压：100 V最大反向电流：40 µA
表面贴装：YES技术：SCHOTTKY
端子形式：J BEND端子位置：DUAL
Base Number Matches：1

NRVBA1H100NT3G 数据手册

 浏览型号NRVBA1H100NT3G的Datasheet PDF文件第2页浏览型号NRVBA1H100NT3G的Datasheet PDF文件第3页浏览型号NRVBA1H100NT3G的Datasheet PDF文件第4页浏览型号NRVBA1H100NT3G的Datasheet PDF文件第5页浏览型号NRVBA1H100NT3G的Datasheet PDF文件第6页 
Surface Mount  
Schottky Power Rectifier  
SMA Power Surface Mount Package  
MBRA1H100, NRVBA1H100,  
NRVBA1H100N  
Employing the Schottky Barrier principle in a large area  
metal−to−silicon power diode. State of the art geometry features  
epitaxial construction with oxide passivation and metal overlay  
contact. Ideally suited for low voltage, high frequency rectification, or  
as free wheeling and polarity diodes in surface mount applications  
where compact size and weight are critical to the system.  
www.onsemi.com  
SCHOTTKY BARRIER  
RECTIFIER  
1.0 AMPERES, 100 VOLTS  
Features  
• Small Compact Surface Mountable Package with J−Bent Leads  
• Rectangular Package for Automated Handling  
• Highly Stable Oxide Passivated Junction  
• Low Forward Voltage Drop  
SMA  
CASE 403D  
• Guardring for Stress Protection  
1
2
• NRVBA Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable*  
Cathode  
Anode  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
MARKING DIAGRAMS  
Compliant  
A110  
AYWWG  
Mechanical Characteristics:  
• Case: Epoxy, Molded  
• Weight: 70 mg (approximately)  
A110  
A
Y
= Device Code  
= Assembly Location**  
= Year  
• Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
• Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
• Polarity: Cathode Lead Indicated by Polarity Band  
**The Assembly Location code (A) is front side  
optional. In cases where the Assembly Location is  
stamped in the package bottom (molding ejecter pin),  
the front side assembly code may be blank.  
• ESD Ratings:  
♦ Machine Model = C  
♦ Human Body Model = 3B  
• Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
†
Device  
Package Shipping  
MBRA1H100T3G  
SMA 5,000 /  
(Pb−Free) Tape & Reel  
SMA 5,000 /  
NRVBA1H100T3G*  
NRVBA1H100NT3G*  
(Pb−Free) Tape & Reel  
SMA 5,000 /  
(Pb−Free) Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
December, 2019 − Rev. 4  
MBRA1H100/D  
123456

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