MBR860MFS, NRVB860MFS
SWITCHMODE
Power Rectifiers
These state−of−the−art devices have the following features:
Features
• Low Power Loss / High Efficiency
• New Package Provides Capability of Inspection and Probe After
http://onsemi.com
Board Mounting
• Guardring for Stress Protection
SCHOTTKY BARRIER
RECTIFIERS
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
• Wettable Flacks Option Available
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
8 AMPERES
60 VOLTS
5,6
1,2,3
• These are Pb−Free Devices
Mechanical Characteristics:
• Case: Epoxy, Molded
MARKING
DIAGRAM
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
A
C
C
1
B860
AYWZZ
A
A
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Not Used
• Device Meets MSL 1 Requirements
MAXIMUM RATINGS
B860
A
= Specific Device Code
= Assembly Location
= Year
Rating
Symbol
Value
Unit
Y
W
ZZ
= Work Week
= Lot Traceability
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
RRM
V
RWM
V
60
R
Average Rectified Forward Current
I
8.0
A
A
F(AV)
(Rated V , T = 165°C)
ORDERING INFORMATION
R
C
Peak Repetitive Forward Current,
I
16
FRM
Device
Package
Shipping†
1500 /
(Rated V , Square Wave,
R
20 kHz, T = 165°C)
MBR860MFST1G
SO−8 FL
C
(Pb−Free) Tape & Reel
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
I
150
A
FSM
MBR860MFST3G
NRVB860MFST1G
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
SO−8 FL 1500 /
(Pb−Free) Tape & Reel
SO−8 FL 5000 /
(Pb−Free) Tape & Reel
Storage Temperature Range
T
−65 to +175
−55 to +175
40
°C
°C
mJ
stg
Operating Junction Temperature
T
J
NRVB860MFST3G
Unclamped Inductive Switching
Energy (10 mH Inductor,
Non−repetitive)
E
AS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
ESD Rating (Human Body Model)
ESD Rating (Machine Model)
3B
M4
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NOTE: The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RJA.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
October, 2013 − Rev. 0
MBR860MFS/D