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NE687M33-FB PDF预览

NE687M33-FB

更新时间: 2024-11-01 14:38:19
品牌 Logo 应用领域
日电电子 - NEC 光电二极管晶体管
页数 文件大小 规格书
7页 55K
描述
RF Small Signal Bipolar Transistor, 0.03A I(C), 1-Element, L Band, Silicon, NPN, SUPER MINIMOLD PACKAGE-3

NE687M33-FB 技术参数

是否Rohs认证:不符合生命周期:Transferred
包装说明:SUPER MINIMOLD PACKAGE-3Reach Compliance Code:compliant
风险等级:5.78Is Samacsys:N
外壳连接:COLLECTOR最大集电极电流 (IC):0.03 A
基于收集器的最大容量:0.7 pF集电极-发射极最大电压:3 V
配置:SINGLE最高频带:L BAND
JESD-30 代码:R-PDSO-F3JESD-609代码:e0
元件数量:1端子数量:3
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:NPN认证状态:Not Qualified
表面贴装:YES端子面层:TIN LEAD
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
标称过渡频率 (fT):12000 MHzBase Number Matches:1

NE687M33-FB 数据手册

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DATA SHEET  
NPN SILICON RF TRANSISTOR  
NE687M33  
NPN SILICON RF TRANSISTOR FOR  
HIGH-FREQUENCY LOW NOISE  
3-PIN SUPER LEAD-LESS MINIMOLD (M33)  
FEATURES  
Low noise  
NF = 1.5 dB TYP. @ VCE = 1 V, IC = 3 mA, f = 2 GHz  
3-pin super lead-less minimold (M33) package  
ORDERING INFORMATION  
Part Number  
Quantity  
Supplying Form  
NE687M33  
50 pcs (Non reel)  
10 kpcs/reel  
• 8 mm wide embossed taping  
• Pin 2 (Base) face the perforation side of the tape  
NE687M33-T3  
Remark To order evaluation samples, contact your nearby sales office.  
The unit sample quantity is 50 pcs.  
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)  
Parameter  
Collector to Base Voltage  
Collector to Emitter Voltage  
Emitter to Base Voltage  
Collector Current  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Ratings  
Unit  
5.0  
V
V
3.0  
2.0  
30  
V
mA  
mW  
°C  
°C  
Note  
Total Power Dissipation  
Junction Temperature  
Storage Temperature  
Ptot  
90  
Tj  
150  
65 to +150  
Tstg  
Note Mounted on 1.08 cm2 × 1.0 mm (t) glass epoxy PCB  
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PU10342EJ02V0DS (2nd edition)  
Date Published August 2003 CP(K)  
The mark  shows major revised points.  
Printed in Japan  
© NEC Compound Semiconductor Devices 2003  

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