MTD9N10E
Preferred Device
Power MOSFET
9 Amps, 100 Volts
N–Channel DPAK
This advanced Power MOSFET is designed to withstand high
energy in the avalanche and commutation modes. The new energy
efficient design also offers a drain–to–source diode with a fast
recovery time. Designed for low voltage, high speed switching
applications in power supplies, converters and PWM motor controls,
these devices are particularly well suited for bridge circuits where
diode speed and commutating safe operating areas are critical and
offer additional safety margin against unexpected voltage transients.
http://onsemi.com
9 AMPERES
100 VOLTS
R
= 250 mΩ
DS(on)
• Avalanche Energy Specified
• Source–to–Drain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
N–Channel
D
• Diode is Characterized for Use in Bridge Circuits
• I
and V
Specified at Elevated Temperature
DSS
DS(on)
• Replaces MTD6N10
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Rating
Drain–Source Voltage
Symbol
Value
100
Unit
Vdc
Vdc
MARKING
DIAGRAM
V
DSS
Drain–Gate Voltage (R
= 1.0 MΩ)
V
DGR
100
GS
4
Gate–Source Voltage
– Continuous
YWW
T9
N10E
CASE 369A
DPAK
STYLE 2
V
± 20
± 30
Vdc
Vpk
GS
2
3
– Non–Repetitive (t ≤ 10 ms)
V
GSM
1
p
Drain Current – Continuous
Drain Current – Continuous @ 100°C
Drain Current – Single Pulse (t ≤ 10 µs)
I
I
9.0
5.0
27
Adc
Apk
D
D
Y
WW
T9
= Year
= Work Week
= MOSFET
I
p
DM
Total Power Dissipation
Derate above 25°C
Total Power Dissipation @ T = 25°C, when
P
40
0.32
1.75
Watts
W/°C
Watts
D
PIN ASSIGNMENT
A
mounted to minimum recommended pad
size
4
Drain
Operating and Storage Temperature
Range
T , T
J stg
–55 to
150
°C
Single Pulse Drain–to–Source Avalanche
E
AS
40
mJ
Energy – Starting T = 25°C
J
(V
= 25 Vdc, V
= 10 Vdc,
GS
1
2
3
DD
= 9.0 Apk, L = 1.0 mH, R = 25 Ω)
I
L
Gate
Drain Source
G
Thermal Resistance
°C/W
°C
ORDERING INFORMATION
– Junction to Case
– Junction to Ambient
– Junction to Ambient, when mounted
to minimum recommended pad size
R
R
R
3.13
100
71.4
θJC
θJA
θJA
Device
Package
DPAK
Shipping
75 Units/Rail
MTD9N10E
Maximum Temperature for Soldering
Purposes, 1/8″ from case for 10
seconds
T
260
L
MTD9N10E1
MTD9N10ET4
DPAK
75 Units/Rail
DPAK
2500 Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
February, 2001 – Rev. 4
MTD9N10E/D