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MTB75N03HDLT4 PDF预览

MTB75N03HDLT4

更新时间: 2024-11-09 14:53:59
品牌 Logo 应用领域
安森美 - ONSEMI 晶体管
页数 文件大小 规格书
12页 120K
描述
75A, 25V, 0.009ohm, N-CHANNEL, Si, POWER, MOSFET, D2PAK-3

MTB75N03HDLT4 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:D2PAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.14
Is Samacsys:N其他特性:LOGIC LEVEL COMPATIBLE
雪崩能效等级(Eas):280 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:25 V
最大漏极电流 (Abs) (ID):75 A最大漏极电流 (ID):75 A
最大漏源导通电阻:0.009 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):2.5 W
最大脉冲漏极电流 (IDM):225 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

MTB75N03HDLT4 数据手册

 浏览型号MTB75N03HDLT4的Datasheet PDF文件第2页浏览型号MTB75N03HDLT4的Datasheet PDF文件第3页浏览型号MTB75N03HDLT4的Datasheet PDF文件第4页浏览型号MTB75N03HDLT4的Datasheet PDF文件第5页浏览型号MTB75N03HDLT4的Datasheet PDF文件第6页浏览型号MTB75N03HDLT4的Datasheet PDF文件第7页 
MTB75N03HDL  
Preferred Device  
Power MOSFET  
75 Amps, 25 Volts, Logic Level  
2
N–Channel D PAK  
This Power MOSFET is designed to withstand high energy in the  
avalanche and commutation modes. The energy efficient design also  
offers a drain–to–source diode with a fast recovery time. Designed for  
low voltage, high speed switching applications in power supplies,  
converters and PWM motor controls, these devices are particularly  
well suited for bridge circuits where diode speed and commutating  
safe operating areas are critical and offer additional safety margin  
against unexpected voltage transients.  
http://onsemi.com  
75 AMPERES  
25 VOLTS  
R
= 9 m  
DS(on)  
Avalanche Energy Specified  
Source–to–Drain Diode Recovery Time Comparable to a Discrete  
Fast Recovery Diode  
N–Channel  
D
Diode is Characterized for Use in Bridge Circuits  
I  
and V Specified at Elevated Temperature  
DS(on)  
DSS  
G
Short Heatsink Tab Manufactured – Not sheared  
Specially Designed Leadframe for Maximum Power Dissipation  
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
4
Rating  
Drain–to–Source Voltage  
Drain–to–Gate Voltage (R  
Symbol  
Value  
25  
Unit  
Vdc  
Vdc  
2
D PAK  
V
DSS  
CASE 418B  
STYLE 2  
2
1
= 1.0 M)  
V
DGR  
25  
GS  
3
Gate–to–Source Voltage  
– Continuous  
V
± 15  
± 20  
Vdc  
Vpk  
GS  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
– Non–Repetitive (t 10 ms)  
p
V
GSM  
Drain Current – Continuous  
Drain Current – Continuous @ 100°C  
Drain Current – Single Pulse (t 10 µs)  
I
I
75  
59  
225  
Adc  
Apk  
D
D
4
Drain  
p
I
DM  
Total Power Dissipation  
Derate above 25°C  
Total Power Dissipation @ T = 25°C  
(Note 1.)  
P
D
125  
1.0  
2.5  
Watts  
W/°C  
Watts  
A
T75N03HDL  
YWW  
Operating and Storage Temperature  
Range  
– 55 to 150  
°C  
Single Pulse Drain–to–Source Avalanche  
E
280  
mJ  
1
Gate  
2
3
AS  
Energy – Starting T = 25°C  
Drain  
Source  
J
GS  
(V  
= 25 Vdc, V  
= 5.0 Vdc,  
DD  
I
L
= 75 Apk, L = 0.1 mH, R = 25 Ω)  
T75N03HDL  
= Device Code  
= Year  
= Work Week  
G
Y
WW  
Thermal Resistance  
°C/W  
°C  
– Junction to Case  
– Junction to Ambient  
– Junction to Ambient (Note 1.)  
R
R
R
1.0  
62.5  
50  
θJC  
θJA  
θJA  
ORDERING INFORMATION  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10  
seconds  
T
260  
L
Device  
Package  
Shipping  
50 Units/Rail  
2
D PAK  
MTB75N03HDL  
MTB75N03HDLT4  
1. When mounted with the minimum recommended pad size.  
2
D PAK  
800/Tape & Reel  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
November, 2000 – Rev.3  
MTB75N03HDL/D  

MTB75N03HDLT4 替代型号

型号 品牌 替代类型 描述 数据表
STB80NE03L-06T4 STMICROELECTRONICS

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