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MTB55N06ZT4 PDF预览

MTB55N06ZT4

更新时间: 2024-11-23 14:53:59
品牌 Logo 应用领域
安森美 - ONSEMI 开关脉冲晶体管
页数 文件大小 规格书
8页 91K
描述
55A, 60V, 0.018ohm, N-CHANNEL, Si, POWER, MOSFET, D2PAK-3

MTB55N06ZT4 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:D2PAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.19其他特性:ESD PROTECTED
雪崩能效等级(Eas):454 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):55 A最大漏极电流 (ID):55 A
最大漏源导通电阻:0.018 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):136 W
最大脉冲漏极电流 (IDM):165 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

MTB55N06ZT4 数据手册

 浏览型号MTB55N06ZT4的Datasheet PDF文件第2页浏览型号MTB55N06ZT4的Datasheet PDF文件第3页浏览型号MTB55N06ZT4的Datasheet PDF文件第4页浏览型号MTB55N06ZT4的Datasheet PDF文件第5页浏览型号MTB55N06ZT4的Datasheet PDF文件第6页浏览型号MTB55N06ZT4的Datasheet PDF文件第7页 
MTB55N06Z  
Preferred Device  
Power MOSFET  
55 Amps, 60 Volts  
2
N–Channel D PAK  
This Power MOSFET is designed to withstand high energy in the  
avalanche mode and switch efficiently. This high energy device also  
offers a drain–to–source diode with fast recovery time. Designed for  
high voltage, high speed switching applications in power supplies,  
PWM motor controls and other inductive loads, the avalanche energy  
capability is specified to eliminate the guesswork in designs where  
inductive loads are switched and offer additional safety margin against  
unexpected voltage transients.  
http://onsemi.com  
55 AMPERES  
60 VOLTS  
R
= 18 m  
DS(on)  
Avalanche Energy Capability Specified at Elevated Temperature  
Source–to–Drain Diode Recovery Time Comparable to a  
Discrete Fast Recovery Diode  
N–Channel  
D
Low Stored Gate Charge for Efficient Switching  
Internal Source–to–Drain Diode Designed to Replace External Zener  
Transient Suppressor–Absorbs High Energy in the Avalanche Mode  
ESD Protected. Designed to Typically Withstand 400 V  
Machine Model and 4000 V Human Body Model.  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
4
Rating  
Symbol  
Value  
Unit  
2
Drain–to–Source Voltage  
V
DSS  
60  
Vdc  
D PAK  
CASE 418B  
STYLE 2  
2
3
Drain–to–Gate Voltage (R  
= 1.0 M)  
V
60  
Vdc  
GS  
DGR  
1
Gate–to–Source Voltage  
– Continuous  
V
±20  
±40  
Vdc  
Vpk  
GS  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
– Non–Repetitive (t 10 ms)  
V
GSM  
p
Drain Current  
– Continuous @ T = 25°C  
4
I
D
I
D
55  
35.5  
165  
Adc  
Apk  
C
Drain  
– Continuous @ T = 100°C  
C
– Single Pulse (t 10 µs)  
I
p
DM  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
113  
0.91  
2.5  
Watts  
W/°C  
C
MTB55N06Z  
YWW  
Total Power Dissipation @ T = 25°C  
A
(Note NO TAG)  
Operating and Storage Temperature  
Range  
T , T  
J stg  
– 55 to  
150  
°C  
1
2
3
Gate  
Drain  
Source  
Single Pulse Drain–to–Source Avalanche  
E
AS  
454  
mJ  
Energy – Starting T = 25°C  
J
MTB55N06Z  
= Device Code  
= Year  
= Work Week  
(V  
= 25 Vdc, V  
= 60 Vdc,  
DD  
DS  
= 10 Vdc, Peak I = 55 Apk,  
L = 0.3 mH, R = 25 )  
Y
WW  
V
GS  
L
G
Thermal Resistance  
°C/W  
°C  
ORDERING INFORMATION  
– Junction to Case  
– Junction to Ambient  
– Junction to Ambient (Note NO TAG)  
R
R
R
1.1  
62.5  
50  
θJC  
θJC  
θJA  
Device  
Package  
Shipping  
50 Units/Rail  
2
D PAK  
MTB55N06Z  
MTB55N06ZT4  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10  
seconds  
T
260  
L
2
D PAK  
800/Tape & Reel  
Preferred devices are recommended choices for future use  
and best overall value.  
1. When surface mounted to an FR4 board using the minimum recommended  
pad size.  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
November, 2000 – Rev. 2  
MTB55N06Z/D  

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