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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| MSCDC50H701AG-Module | MICROCHIP |
获取价格 |
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switch |
|
| MSCDC50X1201AG-Module | MICROCHIP |
获取价格 |
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switch |
|
| MSCDC50X1701AG-Module | MICROCHIP |
获取价格 |
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switch |
|
| MSCDC50X701AG-Module | MICROCHIP |
获取价格 |
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switch |
|
| MSCDC600A120AG | MICROSEMI |
获取价格 |
Rectifier Diode, |
|
| MSCDC600A120AG-Module | MICROCHIP |
获取价格 |
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switch |
|
| MSCDC600A170AG | MICROSEMI |
获取价格 |
Rectifier Diode, |
|
| MSCDC600A170AG-Module | MICROCHIP |
获取价格 |
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switch |
|
| MSCDC600A70AG-Module | MICROCHIP |
获取价格 |
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switch |
|
| MSC-DKCS5 | SILICON |
获取价格 |
Si4010 DEVELOPMENT KIT USERâS GUIDE |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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