Datasheet > MSCDC50H701AG-Module

MSCDC50H701AG-Module

更新时间： 2023-12-06 20:10:47

品牌	Logo	应用领域
美国微芯 - MICROCHIP		/
页数	文件大小	规格书
6页	645K
描述
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switching beha

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MSCDC50H701AG-Module 数据手册

MSCDC50H701AG SiC Diode Full Bridge Power Module

Product Overview

This section shows the product overview of the MSCDC50H701AG device.

All ratings at Tj = 25°C, unless otherwise specified.

Caution: These devices are sensitive to electrostatic discharge. Proper handling procedures should be

followed.

MSCC-0344-DS-01030-1.0-0619 MSCDC50H701AG Datasheet Revision 1.0

12 3 4 5 6

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