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MSCDC50H701AG-Module PDF预览

MSCDC50H701AG-Module

更新时间: 2024-11-21 14:55:31
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
6页 645K
描述
SiC Schottky DiodeZero reverse recoveryZero forward recoveryTemperature Independent switching beha

MSCDC50H701AG-Module 数据手册

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MSCDC50H701AG SiC Diode Full Bridge Power Module  
1
Product Overview  
This section shows the product overview of the MSCDC50H701AG device.  
All ratings at Tj = 25°C, unless otherwise specified.  
Caution: These devices are sensitive to electrostatic discharge. Proper handling procedures should be  
followed.  
MSCC-0344-DS-01030-1.0-0619 MSCDC50H701AG Datasheet Revision 1.0  
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