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MSC8154SVT1000B PDF预览

MSC8154SVT1000B

更新时间: 2024-11-29 20:27:39
品牌 Logo 应用领域
恩智浦 - NXP 外围集成电路
页数 文件大小 规格书
68页 837K
描述
0-BIT, OTHER DSP, PBGA783, 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783

MSC8154SVT1000B 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:BGA, BGA783,28X28,40针数:783
Reach Compliance Code:not_compliantECCN代码:5A992
HTS代码:8542.31.00.01风险等级:5.45
Is Samacsys:N地址总线宽度:
桶式移位器:NO位大小:32
边界扫描:YES外部数据总线宽度:
格式:FIXED POINT内部总线架构:MULTIPLE
JESD-30 代码:S-PBGA-B783长度:29 mm
低功率模式:YES湿度敏感等级:3
端子数量:783最高工作温度:105 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA783,28X28,40
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):245电源:1,2.5 V
认证状态:Not QualifiedRAM(字数):8192
座面最大高度:3.94 mm子类别:Digital Signal Processors
最大供电电压:1.05 V最小供电电压:0.97 V
标称供电电压:1 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper - with Nickel barrier端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:29 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHERBase Number Matches:1

MSC8154SVT1000B 数据手册

 浏览型号MSC8154SVT1000B的Datasheet PDF文件第2页浏览型号MSC8154SVT1000B的Datasheet PDF文件第3页浏览型号MSC8154SVT1000B的Datasheet PDF文件第4页浏览型号MSC8154SVT1000B的Datasheet PDF文件第5页浏览型号MSC8154SVT1000B的Datasheet PDF文件第6页浏览型号MSC8154SVT1000B的Datasheet PDF文件第7页 
Freescale Semiconductor  
Data Sheet  
Document Number: MSC8154  
Rev. 7, 08/2013  
MSC8154  
FC-PBGA–783  
29 mm × 29 mm  
Quad-Core Digital Signal  
Processor  
Four StarCore SC3850 DSP subsystems, each with an SC3850  
DSP core, 32 Kbyte L1 instruction cache, 32 Kbyte L1 data cache,  
unified 512 Kbyte L2 cache configurable as M2 memory in  
64 Kbyte increments, memory management unit (MMU),  
extended programmable interrupt controller (EPIC), two  
general-purpose 32-bit timers, debug and profiling support,  
low-power Wait, Stop, and power-down processing modes, and  
ECC/EDC support.  
Chip-level arbitration and switching system (CLASS) that  
provides full fabric non-blocking arbitration between the cores  
and other initiators and the M2 memory, shared M3 memory,  
DDR SRAM controllers, device configuration control and status  
registers, MAPLE-B, and other targets.  
High-speed serial interface that supports two Serial RapidIO  
interfaces, one PCI Express interface, and two SGMII interfaces  
(multiplexed). The Serial RapidIO interfaces support 1x/4x  
operation up to 3.125 Gbaud with a single messaging unit and two  
DMA units. The PCI Express controller supports 32- and 64-bit  
addressing, x4, x2, and x1 link.  
QUICC Engine technology subsystem with dual RISC  
processors, 48 Kbyte multi-master RAM, 48 Kbyte instruction  
RAM, supporting two communication controllers for two Gigabit  
Ethernet interfaces (RGMII or SGMII), to offload scheduling  
tasks from the DSP cores, and an SPI.  
I/O Interrupt Concentrator consolidates all chip maskable  
interrupt and non-maskable interrupt sources and routes then to  
INT_OUT, NMI_OUT, and the cores.  
UART that permits full-duplex operation with a bit rate of up to  
6.25 Mbps.  
1056 Kbyte 128-bit wide M3 memory, 1024 Kbytes of which can  
be turned off to save power.  
96 Kbyte boot ROM.  
Three input clocks (one global and two differential).  
Five PLLs (three global and two Serial RapidIO PLLs).  
Multi-Accelerator Platform Engine for Baseband (MAPLE-B)  
with a programmable system interface, Turbo decoding, Viterbi  
decoding, and FFT/iFFT and DFT/iDFT processing. MAPLE-B  
can be disabled when not required to reduce overall power  
consumption.  
Two DDR controllers with up to a 400 MHz clock (800 MHz data  
rate), 64/32 bit data bus, supporting up to a total 2 Gbyte in up to  
four banks (two per controller) and support for DDR2 and DDR3.  
DMA controller with 32 unidirectional channels supporting 16  
memory-to-memory channels with up to 1024 buffer descriptors  
per channel, and programmable priority, buffer, and multiplexing  
configuration. It is optimized for DDR SDRAM.  
Two general-purpose 32-bit timers for RTOS support per SC3850  
core, four timer modules with four 16-bit fully programmable  
timers, and eight software watchdog timers (SWT).  
Eight programmable hardware semaphores.  
Up to 32 virtual interrupts and a virtual NMI asserted by simple  
write access.  
I2C interface.  
Up to 32 GPIO ports, sixteen of which can be configured as  
external interrupts.  
Boot interface options include Ethernet, Serial RapidIO interface,  
I2C, and SPI.  
Supports standard JTAG interface  
Low power CMOS design, with low-power standby and  
power-down modes, and optimized power-management circuitry.  
45 nm SOI CMOS technology.  
Up to four independent TDM modules with programmable word  
size (2, 4, 8, or 16-bit), hardware-base A-law/μ-law conversion,  
up to 62.5 Mbps data rate for each TDM link, and with glueless  
interface to E1 or T1 framers that can interface with  
H-MVIP/H.110 devices, TSI, and codecs such as AC-97.  
© 2010–2013 Freescale Semiconductor, Inc.  

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