Table 2. Thermal Characteristics
(1,2)
(3)
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
R
θ
0.19
°C/W
JC
Case Temperature 74°C, 125 W CW, 50 V, 1400 mA, 860 MHz
Table 3. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
Machine Model (per EIA/JESD22--A115)
Charge Device Model (per JESD22--C101)
2 (2001--4000 V)
B (201--400 V)
IV (>1000 V)
Table 4. Electrical Characteristics (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
(4)
Off Characteristics
Gate--Source Leakage Current
I
—
130
—
—
140
—
1
—
5
μAdc
Vdc
GSS
(V = 5 Vdc, V = 0 Vdc)
GS
DS
Drain--Source Breakdown Voltage
(V = 0 Vdc, I = 100 mA)
V
(BR)DSS
GS
D
Zero Gate Voltage Drain Leakage Current
(V = 50 Vdc, V = 0 Vdc)
I
μAdc
μAdc
DSS
DSS
DS
GS
Zero Gate Voltage Drain Leakage Current
I
—
—
20
(V = 100 Vdc, V = 0 Vdc)
DS
GS
On Characteristics
(4)
Gate Threshold Voltage
(V = 10 Vdc, I = 980 μAdc)
V
V
1.5
2.1
—
2.07
2.65
0.24
15.6
2.5
3.1
—
Vdc
Vdc
Vdc
S
GS(th)
GS(Q)
DS(on)
DS
D
(5)
Gate Quiescent Voltage
(V = 50 Vdc, I = 1400 mAdc, Measured in Functional Test)
DD
D
(4)
Drain--Source On--Voltage
(V = 10 Vdc, I = 2 Adc)
V
GS
D
Forward Transconductance
(V = 10 Vdc, I = 20 Adc)
g
—
—
fs
DS
D
(4)
Dynamic Characteristics
(6)
Reverse Transfer Capacitance
C
—
—
—
1.49
79.9
264
—
—
—
pF
pF
pF
rss
(V = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, V = 0 Vdc)
DS
GS
(6)
Output Capacitance
C
oss
(V = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, V = 0 Vdc)
DS
GS
(7)
Input Capacitance
C
iss
(V = 50 Vdc, V = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)
DS
GS
(5)
Functional Tests
(In Freescale Narrowband Test Fixture, 50 ohm system) V = 50 Vdc, I = 1400 mA, P = 125 W Avg., f = 860 MHz,
DD DQ out
DVB--T (8k OFDM) Single Channel. ACPR measured in 7.61 MHz Signal Bandwidth @ ±4 MHz Offset with an Integration Bandwidth of 4 kHz.
Power Gain
G
18.0
29.0
—
19.3
30.0
--60.5
-- 1 2
21.0
—
dB
%
ps
D
Drain Efficiency
η
Adjacent Channel Power Ratio
Input Return Loss
ACPR
IRL
--58.5
-- 9
dBc
dB
—
1. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF
calculators by product.
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
3. Performance with thermal grease TIM (thermal interface material) will typically degrade by 0.05°C/W due to the increased thermal contact
resistance of this TIM.
4. Each side of device measured separately.
5. Measurement made with device in push--pull configuration.
6. Part internally input matched.
7. Die capacitance value without internal matching.
(continued)
MRFE6VP8600HR6 MRFE6VP8600HR5 MRFE6VP8600HSR6 MRFE6VP8600HSR5
RF Device Data
Freescale Semiconductor
2