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MRFE6VP8600H PDF预览

MRFE6VP8600H

更新时间: 2022-04-18 20:40:54
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 晶体晶体管
页数 文件大小 规格书
20页 1270K
描述
RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs

MRFE6VP8600H 数据手册

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Table 2. Thermal Characteristics  
(1,2)  
(3)  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
θ
0.19  
°C/W  
JC  
Case Temperature 74°C, 125 W CW, 50 V, 1400 mA, 860 MHz  
Table 3. ESD Protection Characteristics  
Test Methodology  
Class  
Human Body Model (per JESD22--A114)  
Machine Model (per EIA/JESD22--A115)  
Charge Device Model (per JESD22--C101)  
2 (2001--4000 V)  
B (201--400 V)  
IV (>1000 V)  
Table 4. Electrical Characteristics (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
(4)  
Off Characteristics  
Gate--Source Leakage Current  
I
130  
140  
1
5
μAdc  
Vdc  
GSS  
(V = 5 Vdc, V = 0 Vdc)  
GS  
DS  
Drain--Source Breakdown Voltage  
(V = 0 Vdc, I = 100 mA)  
V
(BR)DSS  
GS  
D
Zero Gate Voltage Drain Leakage Current  
(V = 50 Vdc, V = 0 Vdc)  
I
μAdc  
μAdc  
DSS  
DSS  
DS  
GS  
Zero Gate Voltage Drain Leakage Current  
I
20  
(V = 100 Vdc, V = 0 Vdc)  
DS  
GS  
On Characteristics  
(4)  
Gate Threshold Voltage  
(V = 10 Vdc, I = 980 μAdc)  
V
V
1.5  
2.1  
2.07  
2.65  
0.24  
15.6  
2.5  
3.1  
Vdc  
Vdc  
Vdc  
S
GS(th)  
GS(Q)  
DS(on)  
DS  
D
(5)  
Gate Quiescent Voltage  
(V = 50 Vdc, I = 1400 mAdc, Measured in Functional Test)  
DD  
D
(4)  
Drain--Source On--Voltage  
(V = 10 Vdc, I = 2 Adc)  
V
GS  
D
Forward Transconductance  
(V = 10 Vdc, I = 20 Adc)  
g
fs  
DS  
D
(4)  
Dynamic Characteristics  
(6)  
Reverse Transfer Capacitance  
C
1.49  
79.9  
264  
pF  
pF  
pF  
rss  
(V = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, V = 0 Vdc)  
DS  
GS  
(6)  
Output Capacitance  
C
oss  
(V = 50 Vdc ± 30 mV(rms)ac @ 1 MHz, V = 0 Vdc)  
DS  
GS  
(7)  
Input Capacitance  
C
iss  
(V = 50 Vdc, V = 0 Vdc ± 30 mV(rms)ac @ 1 MHz)  
DS  
GS  
(5)  
Functional Tests  
(In Freescale Narrowband Test Fixture, 50 ohm system) V = 50 Vdc, I = 1400 mA, P = 125 W Avg., f = 860 MHz,  
DD DQ out  
DVB--T (8k OFDM) Single Channel. ACPR measured in 7.61 MHz Signal Bandwidth @ ±4 MHz Offset with an Integration Bandwidth of 4 kHz.  
Power Gain  
G
18.0  
29.0  
19.3  
30.0  
--60.5  
-- 1 2  
21.0  
dB  
%
ps  
D
Drain Efficiency  
η
Adjacent Channel Power Ratio  
Input Return Loss  
ACPR  
IRL  
--58.5  
-- 9  
dBc  
dB  
1. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF  
calculators by product.  
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.  
Select Documentation/Application Notes -- AN1955.  
3. Performance with thermal grease TIM (thermal interface material) will typically degrade by 0.05°C/W due to the increased thermal contact  
resistance of this TIM.  
4. Each side of device measured separately.  
5. Measurement made with device in push--pull configuration.  
6. Part internally input matched.  
7. Die capacitance value without internal matching.  
(continued)  
MRFE6VP8600HR6 MRFE6VP8600HR5 MRFE6VP8600HSR6 MRFE6VP8600HSR5  
RF Device Data  
Freescale Semiconductor  
2

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