MRF9030M
Rev. 9, 5/2006
Freescale Semiconductor
Replaced by MRF9030NR1/NBR1. There are no form, fit or function changes with this part
replacement. N suffix added to part number to indicate transition to lead-free terminations.
Technical Data
RF Power Field Effect Transistors
N-Channel Enhancement-Mode Lateral MOSFETs
MRF9030MR1
MRF9030MBR1
Designed for broadband commercial and industrial applications with frequen-
cies up to 1000 MHz. The high gain and broadband performance of these
devices make them ideal for large-signal, common-source amplifier applications
in 26 volt base station equipment.
• Typical Performance at 945 MHz, 26 Volts
Output Power — 30 Watts PEP
Power Gain — 20 dB
945 MHz, 30 W, 26 V
LATERAL N-CHANNEL
BROADBAND
Efficiency — 41% (Two Tones)
IMD — -31 dBc
RF POWER MOSFETs
• Integrated ESD Protection
• Capable of Handling 5:1 VSWR, @ 26 Vdc, 945 MHz, 30 Watts CW
Output Power
• Excellent Thermal Stability
• Characterized with Series Equivalent Large-Signal Impedance Parameters
CASE 1265-08, STYLE 1
TO-270-2
• Dual-Lead Boltdown Plastic Package Can Also Be Used As Surface
Mount.
PLASTIC
MRF9030MR1
• 200_C Capable Plastic Package
• TO-272-2 in Tape and Reel. R1 Suffix = 500 Units per 44 mm,
13 inch Reel.
• TO-270-2 in Tape and Reel. R1 Suffix = 500 Units per 24 mm,
13 inch Reel.
CASE 1337-03, STYLE 1
TO-272-2
PLASTIC
MRF9030MBR1
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
Drain-Source Voltage
Gate-Source Voltage
V
- 0.5, +65
- 0.5, +15
Vdc
Vdc
DSS
V
GS
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
D
139
0.93
W
W/°C
C
Storage Temperature Range
Operating Junction Temperature
T
- 65 to +150
200
°C
°C
stg
T
J
Table 2. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
R
1.08
°C/W
θ
JC
Table 3. ESD Protection Characteristics
Test Conditions
Class
Human Body Model
1 (Minimum)
M2 (Minimum)
Machine Model
Charge Device Model
MRF9030MR1
MRF9030MBR1
C7 (Minimum)
C6 (Minimum)
Table 4. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22-A113, IPC/JEDEC J-STD-020
3
260
°C
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MRF9030MR1 MRF9030MBR1
RF Device Data
Freescale Semiconductor
1