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MPC5125YVN400 PDF预览

MPC5125YVN400

更新时间: 2024-10-30 07:03:19
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描述
MPC5125 Microcontroller Data Sheet

MPC5125YVN400 数据手册

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Freescale Semiconductor  
Data Sheet: Technical Data  
Document Number: MPC5125  
Rev. 3, 11/2009  
MPC5125  
324 TEPBGA  
23 mm x 23 mm  
MPC5125 Microcontroller  
Data Sheet  
The MPC5125 integrates a high performance e300 CPU core  
based on the Power Architecture™ Technology with a rich set  
of peripheral functions focused on communications and  
systems integration.  
Major features of the MPC5125 are as follows:  
e300 Power Architecture processor core (enhanced  
version of the MPC603e core), operates as fast as  
400 MHz  
Low power design  
Display interface unit (DIU)  
DDR1, DDR2, low-power mobile DDR (LPDDR),  
and 1.8 V/3.3 V SDR DRAM memory controllers  
32 KB on-chip SRAM  
USB 2.0 OTG controller with ULPI interface  
DMA subsystem  
Flexible multi-function external memory bus (EMB)  
interface  
NAND flash controller (NFC)  
LocalPlus interface (LPC)  
10/100Base Ethernet  
MMC/SD/SDIO card host controller (SDHC)  
Programmable serial controller (PSC)  
2
Inter-integrated circuit (I C) communication  
interfaces  
Controller area network (CAN)  
J1850 byte data link controller (BDLC) interface  
On-chip real-time clock (RTC)  
On-chip temperature sensor  
IC Identification module (IIM)  
This document contains information on a product under development. Freescale reserves the  
right to change or discontinue this product without notice.  
© Freescale Semiconductor, Inc., 2008–2009. All rights reserved.  

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