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MPC5200CVR266BR2 PDF预览

MPC5200CVR266BR2

更新时间: 2024-11-06 20:07:39
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
80页 788K
描述
266MHz, MICROPROCESSOR, PBGA272, 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272

MPC5200CVR266BR2 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA272,20X20,50
针数:272Reach Compliance Code:unknown
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
风险等级:5.73其他特性:ALSO REQUIRES 3.3V SUPPLY
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:35 MHz
外部数据总线宽度:32格式:FIXED POINT
集成缓存:YESJESD-30 代码:S-PBGA-B272
长度:27 mm低功率模式:YES
端子数量:272最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA272,20X20,50
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.5,3.3 V
认证状态:Not Qualified座面最大高度:2.65 mm
速度:266 MHz子类别:Microprocessors
最大供电电压:1.58 V最小供电电压:1.42 V
标称供电电压:1.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:27 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR
Base Number Matches:1

MPC5200CVR266BR2 数据手册

 浏览型号MPC5200CVR266BR2的Datasheet PDF文件第2页浏览型号MPC5200CVR266BR2的Datasheet PDF文件第3页浏览型号MPC5200CVR266BR2的Datasheet PDF文件第4页浏览型号MPC5200CVR266BR2的Datasheet PDF文件第5页浏览型号MPC5200CVR266BR2的Datasheet PDF文件第6页浏览型号MPC5200CVR266BR2的Datasheet PDF文件第7页 
MPC5200BDS  
Rev. 0.6, 10/2005  
Freescale Semiconductor  
Data Sheet: Technical Data  
MPC5200B Data Sheet  
Table of Contents  
NOTE  
1
2
3
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Electrical and Thermal Characteristics . . . . . . . . . 6  
3.1 DC Electrical Characteristics . . . . . . . . . . . . . 6  
3.2 Oscillator and PLL Electrical Characteristics 12  
3.3 AC Electrical Characteristics . . . . . . . . . . . . 14  
Package Description. . . . . . . . . . . . . . . . . . . . . . 61  
4.1 Package Parameters . . . . . . . . . . . . . . . . . . 61  
4.2 Mechanical Dimensions. . . . . . . . . . . . . . . . 61  
4.3 Pinout Listings . . . . . . . . . . . . . . . . . . . . . . . 63  
System Design Information. . . . . . . . . . . . . . . . . 68  
5.1 Power Up/Down Sequencing. . . . . . . . . . . . 68  
5.2 System and CPU Core AVDD Power Supply Fil-  
tering70  
The information in this  
document is subject to  
change. For the latest data  
on the MPC5200B, visit  
www.mobilegt.com and  
proceed to the  
4
5
MPC5200B Product  
Summary Page.  
1 Overview  
The MPC5200B integrates a high performance  
MPC603e series e300 core with a rich set of peripheral  
functions focused on communications and systems  
integration. The e300 core design is based on the  
5.3 Pull-up/Pull-down Resistor Requirements . . 70  
5.4 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71  
Ordering Information. . . . . . . . . . . . . . . . . . . . . . 75  
6
7
Document Revision History . . . . . . . . . . . . . 76  
®
PowerPC core architecture. MPC5200B incorporates  
an innovative BestComm I/O subsystem, which isolates  
routine maintenance of peripheral functions from the  
embedded e300 core. The MPC5200B contains a  
SDRAM/DDR Memory Controller, a flexible External  
Bus Interface, PCI Controller, USB, ATA, Ethernet, six  
© Freescale Semiconductor, Inc., 2005. All rights reserved.  

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