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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| MPC2604GAZP66R | MOTOROLA |
获取价格 |
Cache Tag SRAM, 32KX36, 10ns, MOS, PBGA357, 25 MM, PLASTIC, BGA-357 |
|
| MPC2605 | MOTOROLA |
获取价格 |
Integrated Secondary Cache for PowerPC Microprocessors |
|
| MPC2605ZP66 | MOTOROLA |
获取价格 |
Integrated Secondary Cache for PowerPC Microprocessors |
|
| MPC2605ZP66R | MOTOROLA |
获取价格 |
Integrated Secondary Cache for PowerPC Microprocessors |
|
| MPC2605ZP83 | MOTOROLA |
获取价格 |
32KX72 CACHE TAG SRAM, 8ns, PBGA241, PLASTIC, BGA-241 |
|
| MPC2605ZP83R | MOTOROLA |
获取价格 |
Cache Tag SRAM, 32KX72, 8ns, BICMOS, PBGA241, PLASTIC, BGA-241 |
|
| MPC273H250AFK | KEMET |
获取价格 |
Film Capacitor, Polypropylene, 250V, 3% +Tol, 3% -Tol, 0.027uF, Through Hole Mount, RADIAL |
|
| MPC274J250AF | KEMET |
获取价格 |
Film Capacitor, Polypropylene, 250V, 5% +Tol, 5% -Tol, 0.27uF, Through Hole Mount, RADIAL |
|
| MPC274J800AM | KEMET |
获取价格 |
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 800V, 0.27uF, THROUGH HOLE MOUNT, RADIAL LEADED |
|
| MPC274K400ADK | KEMET |
获取价格 |
Film Capacitor, Polypropylene, 400V, 10% +Tol, 10% -Tol, 0.27uF, Through Hole Mount, RADIA |
|
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
意法半导体发布第四代SiC技术，助力电动汽车电驱
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