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MPC190VFB PDF预览

MPC190VFB

更新时间: 2024-10-29 21:09:47
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA /
页数 文件大小 规格书
16页 56K
描述
Data Encryption Circuit, PBGA252,

MPC190VFB 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:BGA, BGA252,16X16,50Reach Compliance Code:unknown
风险等级:5.86JESD-30 代码:S-PBGA-B252
端子数量:252最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA252,16X16,50
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.8,3.3 V认证状态:Not Qualified
子类别:Telecom Encryption Circuits表面贴装:YES
电信集成电路类型:DATA ENCRYPTION CIRCUIT温度等级:COMMERCIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOMBase Number Matches:1

MPC190VFB 数据手册

 浏览型号MPC190VFB的Datasheet PDF文件第2页浏览型号MPC190VFB的Datasheet PDF文件第3页浏览型号MPC190VFB的Datasheet PDF文件第4页浏览型号MPC190VFB的Datasheet PDF文件第5页浏览型号MPC190VFB的Datasheet PDF文件第6页浏览型号MPC190VFB的Datasheet PDF文件第7页 
Advance Information  
MPC190CE/D  
Rev. 3, 7/2003  
MPC190  
Security Processor  
Chip Errata  
This document details all known silicon errata for the MPC190 and its derivatives. Table 1  
provides a revision history for this document.  
Table 1. Document Revision History  
Rev. No.  
Substantive Changes  
0
1
2
3
Initial release.  
Added Errata 8.  
Added Errata 9–11.  
Added Errata 12. Updated template.  
Table 2 provides a revision history of the MPC190 silicon.  
Table 2. Silicon Revision History  
Silicon Revision  
Applicable Errata/Enhancements  
PPC190VF  
XPC190VFA  
XPC190VFB  
1–8, 12  
3–6, 8, 12  
3–6, 9–12  
 
 
 

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