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MMDT5401_2 PDF预览

MMDT5401_2

更新时间: 2024-09-28 10:51:55
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
4页 164K
描述
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

MMDT5401_2 数据手册

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MMDT5401  
DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR  
Features  
A
Epitaxial Planar Die Construction  
SOT-363  
B1  
C2  
E1  
Complementary NPN Type Available (MMDT5551)  
Ideal for Medium Power Amplification and Switching  
Ultra-Small Surface Mount Package  
Lead Free/RoHS Compliant (Note 3)  
"Green" Device (Note 4 and 5)  
Dim  
A
B
C
D
F
Min  
0.10  
1.15  
2.00  
Max  
0.30  
1.35  
2.20  
C
B
B2  
C1  
E2  
G
H
0.65 Nominal  
Mechanical Data  
0.30  
1.80  
0.40  
2.20  
0.10  
1.00  
0.40  
0.25  
8°  
Case: SOT-363  
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0  
K
J
H
J
M
K
L
0.90  
0.25  
0.10  
0°  
L
D
F
Moisture Sensitivity: Level 1 per J-STD-020C  
Terminals: Solderable per MIL-STD-202, Method 208  
Lead Free Plating (Matte Tin Finish annealed  
over Alloy 42 leadframe).  
Terminal Connections: See Diagram  
Marking Information: K4M, See Page 3  
Ordering & Date Code Information: See Page 3  
Weight: 0.006 grams (approximate)  
M
α
All Dimensions in mm  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Base Voltage  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Value  
-160  
Unit  
V
Collector-Emitter Voltage  
Emitter-Base Voltage  
-150  
V
-5.0  
V
Collector Current – Continuous  
(Note 1)  
(Note 1,2)  
(Note 1)  
-200  
mA  
mW  
Power Dissipation  
200  
Pd  
Thermal Resistance, Junction to Ambient  
Operating and Storage and Temperature Range  
625  
°C/W  
°C  
Rθ  
JA  
-55 to +150  
Tj, TSTG  
Notes:  
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which  
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.  
2. Maximum combined dissipation.  
3. No purposefully added lead.  
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
MMDT5401  
© Diodes Incorporated  
DS30169 Rev. 9 - 2  
1 of 4  
www.diodes.com  

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