Thermal Characteristics(3)
Values are at TA = 25°C unless otherwise noted.
Symbol
PD
Parameter
Max.
225
1.8
Unit
mW
Total Device Dissipation
Derate Above 25°C
mW/°C
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
556
Note:
3. Device mounted on FR-4 PCB 1.6 inch X 1.6 inch X 0.06 inch.
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Conditions
Min.
Max.
Unit
Off Characteristics
V(BR)GSS Gate-Source Breakdown Voltage IG = -1.0 μA, VDS = 0
-40
V
VGS = -20 V, VDS = 0
-10
-25
pA
nA
IGSS
Gate Reverse Current
VGS = -20 V, VDS = 0, TA = 150°C
MMBF4117
-0.6
-1.0
-2.0
-1.8
-3.0
-6.0
VGS(off) Gate-Source Cut-Off Voltage
VDS = -10 V, ID = 1.0 nA MMBF4118
MMBF4119
V
On Characteristics
MMBF4117
30
80
90
Zero-Gate Voltage Drain
IDSS
VDS = 10 V, VGS = 0
MMBF4118
MMBF4119
240
600
μA
Current(4)
200
Small Signal Characteristics
MMBF4117
MMBF4118
MMBF4119
MMBF4117
MMBF4118
MMBF4119
MMBF4117
MMBF4118
MMBF4119
70
80
210
250
330
3.0
Common-Source Forward
Transconductance
VDS = 10 V, VGS = 0,
f = 1.0 kHz
gfs
μmhos
μmhos
μmhos
100
Common-Source Output
Conductance
VDS = 10 V, VGS = 0,
f = 1.0 kHz
goss
5.0
10.0
60
70
90
Common-Source Forward
Re(yfs)
VDS = 10 V, VGS = 0,
f = 30 MHz
Transconductance
Ciss
Crss
Input Capacitance
VDS = 10 V, VGS = 0, f = 1.0 kHz
VDS = 10 V, VGS = 0, f = 1.0 MHz
3.0
1.5
pF
pF
Reverse Transfer Capacitance
Note:
4. Pulse test: pulse width ≤ 300 μs, duty cycle ≤ 1.0%
© 1997 Fairchild Semiconductor Corporation
MMBF4117 / MMBF4118 / MMBF4119 Rev. 1.4
www.fairchildsemi.com
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