是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 33 X 33 MM, CERAMIC, BGA-1023 |
针数: | 1023 | Reach Compliance Code: | not_compliant |
ECCN代码: | 3A991 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.28 | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 1000 MHz | 外部数据总线宽度: | 32 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CBGA-B1023 | JESD-609代码: | e0 |
长度: | 33 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 1023 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装等效代码: | BGA1023,32X32,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 245 |
电源: | 1.1,1.8/2.5,2.5/3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.97 mm | 速度: | 166.66 MHz |
子类别: | Microprocessors | 最大供电电压: | 1.1 V |
最小供电电压: | 1 V | 标称供电电压: | 1.05 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 33 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC8641DHX1000H | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1000J | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1000JC | NXP |
获取价格 |
MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | |
MC8641DHX1000K | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1000N | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1000NB | NXP |
获取价格 |
32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | |
MC8641DHX1000NC | NXP |
获取价格 |
32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | |
MC8641DHX1250G | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1250GB | NXP |
获取价格 |
32-BIT, 1250MHz, MICROPROCESSOR, CBGA1023 | |
MC8641DHX1250H | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications |