生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 1023 |
Reach Compliance Code: | unknown | 风险等级: | 5.29 |
地址总线宽度: | 16 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 166.66 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-CBGA-B1023 |
长度: | 33 mm | 低功率模式: | YES |
端子数量: | 1023 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 2.97 mm | 速度: | 1250 MHz |
最大供电电压: | 1.1 V | 最小供电电压: | 1 V |
标称供电电压: | 1.05 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
宽度: | 33 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MC8641DHX1250H | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1250HB | NXP |
获取价格 |
32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023 | |
MC8641DHX1250J | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1250JC | NXP |
获取价格 |
MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | |
MC8641DHX1250K | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1250N | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1250NC | NXP |
获取价格 |
MICROPROCESSOR, CBGA1023, 33 X 33 MM, ROHS COMPLIANT, CERAMIC, BGA-1023 | |
MC8641DHX1333G | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1333H | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications | |
MC8641DHX1333J | FREESCALE |
获取价格 |
Integrated Host Processor Hardware Specifications |