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MC8641DHX1333JB PDF预览

MC8641DHX1333JB

更新时间: 2024-09-19 04:19:27
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
129页 1820K
描述
32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023, 33 X 33 MM, CERAMIC, BGA-1023

MC8641DHX1333JB 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:33 X 33 MM, CERAMIC, BGA-1023
针数:1023Reach Compliance Code:not_compliant
ECCN代码:3A991HTS代码:8542.31.00.01
风险等级:5.35地址总线宽度:32
位大小:32边界扫描:YES
最大时钟频率:1333 MHz外部数据总线宽度:32
格式:FLOATING POINT集成缓存:YES
JESD-30 代码:S-CBGA-B1023JESD-609代码:e0
长度:33 mm低功率模式:YES
湿度敏感等级:3端子数量:1023
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:BGA
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):225认证状态:Not Qualified
座面最大高度:2.97 mm速度:166.66 MHz
最大供电电压:1.1 V最小供电电压:1 V
标称供电电压:1.05 V表面贴装:YES
技术:CMOS端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:33 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR

MC8641DHX1333JB 数据手册

 浏览型号MC8641DHX1333JB的Datasheet PDF文件第2页浏览型号MC8641DHX1333JB的Datasheet PDF文件第3页浏览型号MC8641DHX1333JB的Datasheet PDF文件第4页浏览型号MC8641DHX1333JB的Datasheet PDF文件第5页浏览型号MC8641DHX1333JB的Datasheet PDF文件第6页浏览型号MC8641DHX1333JB的Datasheet PDF文件第7页 
Document Number: MPC8641D  
Rev. 3, 05/2014  
Freescale Semiconductor  
Technical Data  
MPC8641 and MPC8641D  
Integrated Host Processor  
Hardware Specifications  
Contents  
1 Overview  
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6  
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14  
4. Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 20  
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 21  
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28  
8. Ethernet: Enhanced Three-Speed Ethernet (eTSEC),  
MII Management . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
9. Ethernet Management Interface Electrical  
The MPC8641 processor family integrates either one or two  
Power Architecture® e600 processor cores with system  
logic required for networking, storage, wireless  
infrastructure, and general-purpose embedded applications.  
The MPC8641 integrates one e600 core while the  
MPC8641D integrates two cores.  
This section provides a high-level overview of the MPC8641  
and MPC8641D features. When referring to the MPC8641  
throughout the document, the functionality described applies  
to both the MPC8641 and the MPC8641D. Any differences  
specific to the MPC8641D are noted.  
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43  
10. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45  
11. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
12. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
13. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 59  
14. PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69  
15. Serial RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
16. Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88  
17. Signal Listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91  
18. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104  
19. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108  
20. System Design Information . . . . . . . . . . . . . . . . . . 116  
21. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 126  
22. Document Revision History . . . . . . . . . . . . . . . . . . 128  
Figure 1 shows the major functional units within the  
MPC8641 and MPC8641D. The major difference between  
the MPC8641 and MPC8641D is that there are two cores on  
the MPC8641D.  
Freescale reserves the right to change the detail specifications as may be required  
to permit improvements in the design of its products.  
© 2008-2014 Freescale Semiconductor, Inc. All rights reserved.  

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