MC14007UB
Dual Complementary Pair
Plus Inverter
The MC14007UB multipurpose device consists of three N−Channel
and three P−Channel enhancement mode devices packaged to provide
access to each device. These versatile parts are useful in inverter
circuits, pulse−shapers, linear amplifiers, high input impedance
amplifiers, threshold detectors, transmission gating, and functional
gating.
http://onsemi.com
MARKING
DIAGRAMS
14
Features
PDIP−14
P SUFFIX
CASE 646
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
• Pin−for−Pin Replacement for CD4007A or CD4007UB
• This device has 2 outputs without ESD Protection. Antistatic
precautions must be taken.
MC14007UBCP
AWLYYWWG
1
14
SOIC−14
D SUFFIX
CASE 751A
14007UG
AWLYWW
• Pb−Free Packages are Available
1
14
MAXIMUM RATINGS (Voltages Referenced to V
)
SS
SOEIAJ−14
F SUFFIX
CASE 965
MC14007UB
ALYWG
Symbol
Parameter
Value
−0.5 to +18.0
Unit
V
V
DC Supply Voltage Range
DD
1
V , V
in out
Input or Output Voltage Range
(DC or Transient)
−0.5 to V +0.5
V
DD
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
I , I
Input or Output Current
(DC or Transient) per Pin
±10
mA
in out
P
Power Dissipation, per Package
(Note 1)
500
mW
D
WW, W = Work Week
= Pb−Free Indicator
G
T
Ambient Temperature Range
Storage Temperature Range
−55 to +125
−65 to +150
260
°C
°C
°C
A
T
stg
PIN ASSIGNMENT
T
Lead Temperature
(8 second Soldering)
L
D−P
S−P
1
2
3
4
5
6
7
14
V
DD
B
B
B
B
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
13 D−P
A
GATE
S−N
12 OUT
C
11 S−P
C
Plastic “P and D/DW” Packages: – 7.0 mW/°C from 65°C 5o 125°C.
D−N
10 GATE
C
B
GATE
9
8
S−N
C
A
V
D−N
A
SS
D = DRAIN
S = SOURCE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
October, 2006 − Rev. 8
MC14007UB/D