MC100EL38DWR2

更新时间： 2024-11-02 05:22:27

品牌	Logo	应用领域
安森美 - ONSEMI		时钟驱动器时钟发生器逻辑集成电路光电二极管输出元件
页数	文件大小	规格书
7页	123K
描述
5V ECL ±2, ±4/6 Clock Generation Chip

阅读下载

中文翻译

获取价格

技术参数
数据手册
替代型号

如果您发现信息不准确，欢迎纠错

MC100EL38DWR2 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	SOIC	包装说明：	SOIC-20
针数：	20	Reach Compliance Code：	not_compliant
HTS代码：	8542.39.00.01	风险等级：	7.55
Is Samacsys：	N	其他特性：	NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
系列：	100EL	输入调节：	DIFFERENTIAL
JESD-30 代码：	R-PDSO-G20	JESD-609代码：	e0
长度：	12.8 mm	逻辑集成电路类型：	LOW SKEW CLOCK DRIVER
最大I（ol）：	0.1 A	功能数量：	1
反相输出次数：		端子数量：	20
实输出次数：	4	最高工作温度：	85 °C
最低工作温度：	-40 °C	输出特性：	OPEN-EMITTER
封装主体材料：	PLASTIC/EPOXY	封装代码：	SOP
封装等效代码：	SOP20,.25	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	峰值回流温度（摄氏度）：	240
电源：	-4.5 V	传播延迟（tpd）：	1.05 ns
认证状态：	Not Qualified	Same Edge Skew-Max（tskwd）：	0.075 ns
座面最大高度：	2.65 mm	子类别：	Clock Drivers
最大供电电压 (Vsup)：	5.7 V	最小供电电压 (Vsup)：	4.2 V
标称供电电压 (Vsup)：	5 V	表面贴装：	YES
技术：	ECL	温度等级：	INDUSTRIAL
端子面层：	Tin/Lead (Sn80Pb20)	端子形式：	GULL WING
端子节距：	1.27 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	30	宽度：	7.5 mm
最小 fmax：	1000 MHz	Base Number Matches：	1

MC100EL38DWR2 数据手册

MC100EL38

5VꢀECL ÷2, ÷4/6 Clock

Generation Chip

The MC100EL38 is a low skew ÷2, ÷4/6 clock generation chip

designed explicitly for low skew clock generation applications. The

internal dividers are synchronous to each other, therefore, the common

output edges are all precisely aligned. The device can be driven by

either a differential or single-ended ECL or, if positive power supplies

are used, PECL input signal.

http://onsemi.com

The V pin, an internally generated voltage supply, is available to

this device only. For single-ended input conditions, the unused

differential input is connected to V as a switching reference voltage.

may also rebias AC coupled inputs. When used, decouple V

and V via a 0.01 mF capacitor and limit current sourcing or sinking

SO−20 WB

DW SUFFIX

CASE 751D

to 0.5 mA. When not used, V should be left open.

The common enable (EN) is synchronous so that the internal

dividers will only be enabled/disabled when the internal clock is

already in the LOW state. This avoids any chance of generating a runt

clock pulse on the internal clock when the device is enabled/disabled

as can happen with an asynchronous control. An internal runt pulse

could lead to losing synchronization between the internal divider

stages. The internal enable flip−flop is clocked on the falling edge of

the input clock, therefore, all associated specification limits are

referenced to the negative edge of the clock input.

MARKING DIAGRAM*

100EL38

AWLYYWWG

The Phase_Out output will go HIGH for one clock cycle whenever

the ÷2 and the ÷4/6 outputs are both transitioning from a LOW to a

HIGH. This output allows for clock synchronization within the system.

Upon startup, the internal flip-flops will attain a random state;

therefore, for systems which utilize multiple EL38s, the master reset

(MR) input must be asserted to ensure synchronization. For systems

which only use one EL38, the MR pin need not be exercised as the

internal divider design ensures synchronization between the ÷2 and

the ÷4/6 outputs of a single device.

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

*For additional marking information, refer to

Application Note AND8002/D.

• 50 ps Output-to-Output Skew

• Synchronous Enable/Disable

• Master Reset for Synchronization

• ESD Protection: > 2 kV Human Body Model,

> 100 V Machine Model

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

• The 100 Series Contains Temperature Compensation

• PECL Mode Operating Range: V = 4.2 V to 5.7 V

• Moisture Sensitivity Level 1

with V = 0 V

For Additional Information, see Application Note

AND8003/D

• NECL Mode Operating Range: V = 0 V with

• Flammability Rating: UL 94 V−0 @ 0.125 in,

Oxygen Index: 28 to 34

• Transistor Count = 388 devices

• Pb−Free Packages are Available*

= −4.2 V to −5.7 V

• Internal 75 kW Input Pulldown Resistors on CLK, EN,

MR, and DIVSEL

• Q Output will Default LOW with Inputs Open or at

• Meets or Exceeds JEDEC Spec EIA/JESD78 IC

Latchup Test

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

October, 2006 − Rev. 7

MC100EL38/D

12 3 4 5 6 7

中文翻译

下载PDF

MC100EL38DWR2 替代型号

型号	品牌	替代类型	描述	数据表
MC100EL38DWR2G	ONSEMI	完全替代	5V ECL ±2, ±4/6 Clock Generation Chip
MC100EL38DWG	ONSEMI	完全替代	5V ECL ±2, ±4/6 Clock Generation Chip

与MC100EL38DWR2相关器件

型号	品牌	获取价格	描述	数据表
MC100EL38DWR2G	ONSEMI	获取价格	5V ECL ±2, ±4/6 Clock Generation Chip
MC100EL39	MOTOROLA	获取价格	±2/4,±4/6 Clock Generation Chip
MC100EL39	ONSEMI	获取价格	±2/4, ±4/6 Clock Generation Chip
MC100EL39DW	MOTOROLA	获取价格	±2/4,±4/6 Clock Generation Chip
MC100EL39DW	ONSEMI	获取价格	5V ECL ±2/4, ±4/6 Clock Generation Chip
MC100EL39DWG	ONSEMI	获取价格	5V ECL ±2/4, ±4/6 Clock Generation Chip
MC100EL39DWR2	ONSEMI	获取价格	5V ECL ±2/4, ±4/6 Clock Generation Chip
MC100EL39DWR2G	ONSEMI	获取价格	5V ECL ±2/4, ±4/6 Clock Generation Chip
MC100EL51	ONSEMI	获取价格	Differential Clock D Flip-Flop
MC100EL51D	MOTOROLA	获取价格	Differential Clock D Flip-Flop

与MC100EL38DWR2相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

5
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

2
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

23
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

24

产品中心

服务支持

精选活动

关于我们

帮助中心

MC100EL38DWR2

MC100EL38DWR2 技术参数

MC100EL38DWR2 数据手册

MC100EL38DWR2 替代型号

与MC100EL38DWR2相关器件

与MC100EL38DWR2相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

MC100EL38DWR2

MC100EL38DWR2 技术参数

MC100EL38DWR2 数据手册

MC100EL38DWR2 替代型号

与MC100EL38DWR2相关器件

与MC100EL38DWR2相关文章

您还可以找

您在本页遇到什么问题？