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MB84VD23180FM-70PBS-E1 PDF预览

MB84VD23180FM-70PBS-E1

更新时间: 2024-11-30 14:53:07
品牌 Logo 应用领域
飞索 - SPANSION 静态存储器内存集成电路
页数 文件大小 规格书
49页 693K
描述
Memory Circuit, 4MX16, CMOS, PBGA73, PLASTIC, FBGA-73

MB84VD23180FM-70PBS-E1 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA,
针数:73Reach Compliance Code:compliant
HTS代码:8542.32.00.71风险等级:5.29
Is Samacsys:N其他特性:SRAM IS ORGANISED AS 256K X 16
JESD-30 代码:R-PBGA-B73JESD-609代码:e1
长度:11.6 mm内存密度:67108864 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:16
功能数量:1端子数量:73
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-30 °C组织:4MX16
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.34 mm最大供电电压 (Vsup):3.1 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:8 mmBase Number Matches:1

MB84VD23180FM-70PBS-E1 数据手册

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TM  
SPANSION MCP  
Data Sheet  
September 2003  
This document specifies SPANSIONTM memory products that are now offered by both Advanced Micro Devices and  
Fujitsu. Although the document is marked with the name of the company that originally developed the specification,  
these products will be offered to customers of both AMD and Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a SPANSIONTM product. Future routine  
revisions will occur when appropriate, and changes will be noted in a revision summary.  
Continuity of Ordering Part Numbers  
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these  
products, please use only the Ordering Part Numbers listed in this document.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about SPANSIONTM memory  
solutions.  

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