是否Rohs认证: | 不符合 | 生命周期: | Contact Manufacturer |
包装说明: | TFBGA, | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.76 |
Is Samacsys: | N | JESD-30 代码: | R-PBGA-B71 |
JESD-609代码: | e0 | 长度: | 11 mm |
内存密度: | 33554432 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 71 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 2MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 3.1 V | 最小供电电压 (Vsup): | 2.6 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MB82DP04183B-65 | FUJITSU |
获取价格 |
DRAM | |
MB82DP04183C | FUJITSU |
获取价格 |
64M Bit (4 M word 】 16 bit) Mobile Phone Appl | |
MB82DP04183C-65LWFKT | FUJITSU |
获取价格 |
64M Bit (4 M word 】 16 bit) Mobile Phone Appl | |
MB82DP04183D-65L | FUJITSU |
获取价格 |
Pseudo Static RAM, 4MX16, 65ns, CMOS, PBGA71, PLASTIC, FBGA-71 | |
MB82DP04184E-65L | FUJITSU |
获取价格 |
64M Bit (4 M word 】 16 bit) Mobile Phone Appl | |
MB82DP04184E-65LTBG | FUJITSU |
获取价格 |
64M Bit (4 M word 】 16 bit) Mobile Phone Appl | |
MB82DPS02183B-80 | FUJITSU |
获取价格 |
DRAM | |
MB82DPS02183B-85L | FUJITSU |
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DRAM | |
MB82DPS02183B-85LPBN | FUJITSU |
获取价格 |
Pseudo Static RAM, 2MX16, 85ns, CMOS, PBGA48, 0.75 MM PITCH, PLASTIC, FBGA-48 | |
MB82DPS02183B-85PBN | FUJITSU |
获取价格 |
Pseudo Static RAM, 2MX16, 85ns, CMOS, PBGA48, 0.75 MM PITCH, PLASTIC, FBGA-48 |