是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | DIE, WAFER | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | 最长访问时间: | 65 ns |
I/O 类型: | COMMON | JESD-30 代码: | X-XUUC-N |
长度: | 11 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | PSEUDO STATIC RAM | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 71 |
字数: | 4194304 words | 字数代码: | 4000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 组织: | 4MX16 |
输出特性: | 3-STATE | 封装主体材料: | UNSPECIFIED |
封装代码: | DIE | 封装等效代码: | WAFER |
封装形状: | UNSPECIFIED | 封装形式: | UNCASED CHIP |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大待机电流: | 0.00001 A |
子类别: | Other Memory ICs | 最大压摆率: | 0.04 mA |
最大供电电压 (Vsup): | 3.1 V | 最小供电电压 (Vsup): | 2.6 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | NO LEAD | 端子节距: | 0.8 mm |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MB82DP04183D-65L | FUJITSU |
获取价格 |
Pseudo Static RAM, 4MX16, 65ns, CMOS, PBGA71, PLASTIC, FBGA-71 | |
MB82DP04184E-65L | FUJITSU |
获取价格 |
64M Bit (4 M word 】 16 bit) Mobile Phone Appl | |
MB82DP04184E-65LTBG | FUJITSU |
获取价格 |
64M Bit (4 M word 】 16 bit) Mobile Phone Appl | |
MB82DPS02183B-80 | FUJITSU |
获取价格 |
DRAM | |
MB82DPS02183B-85L | FUJITSU |
获取价格 |
DRAM | |
MB82DPS02183B-85LPBN | FUJITSU |
获取价格 |
Pseudo Static RAM, 2MX16, 85ns, CMOS, PBGA48, 0.75 MM PITCH, PLASTIC, FBGA-48 | |
MB82DPS02183B-85PBN | FUJITSU |
获取价格 |
Pseudo Static RAM, 2MX16, 85ns, CMOS, PBGA48, 0.75 MM PITCH, PLASTIC, FBGA-48 | |
MB82DS01181E | FUJITSU |
获取价格 |
Mobile Phone Application Specific Memory | |
MB82DS01181E-70L | FUJITSU |
获取价格 |
DRAM | |
MB82DS01181E-70LWT-A | FUJITSU |
获取价格 |
Mobile Phone Application Specific Memory |