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MAGX-011086 PDF预览

MAGX-011086

更新时间: 2024-11-25 01:10:55
品牌 Logo 应用领域
泰科 - TE /
页数 文件大小 规格书
10页 1326K
描述
GaN Wideband Transistor 28 V, 4 W

MAGX-011086 数据手册

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MAGX-011086  
GaN Wideband Transistor 28 V, 4 W  
DC - 6 GHz  
Rev. V1  
Features  
GaN on Si HEMT D-Mode Transistor  
Suitable for linear and saturated applications  
Tunable from DC - 6 GHz  
28 V Operation  
9 dB Gain at 5.8 GHz  
45% Drain Efficiency at 5.8 GHz  
100% RF Tested  
Thermally-Enhanced 4 mm 24-Lead QFN  
RoHS* Compliant  
Description  
Functional Schematic  
The MAGX-011086 GaN HEMT is a wideband  
transistor optimized for DC - 6 GHz operation in a  
user friendly package ideal for high bandwidth  
applications. The device has been designed for  
saturated and linear operation with output power  
levels of 4 W (36 dBm) in an industry standard, low  
inductance, surface mount QFN package. The pads  
of the package form a coplanar launch that naturally  
absorbs lead parasitics and features a small PCB  
outline for space constrained applications.  
N/C  
N/C  
N/C  
N/C  
N/C  
20  
N/C  
19  
24  
23  
22  
21  
1
2
3
4
5
6
18 N/C  
N/C  
N/C  
17 N/C  
16 RFOUT / VD  
15 RFOUT / VD  
14 N/C  
RFIN / VG  
RFIN / VG  
N/C  
Input  
Match  
The MAGX-011086 is ideally suited for Wireless  
LAN, High Dynamic Range LNA’s, broadband  
general purpose, land mobile radio, defense  
communications, wireless infrastructure, and ISM  
applications.  
25  
Paddle  
13 N/C  
N/C  
7
8
9
N/C  
10  
N/C  
11  
12  
N/C  
N/C  
N/C  
N/C  
Built using the SIGANTIC® process - a proprietary  
GaN-on-Silicon technology.  
Pin Configuration1  
Pin No.  
Pin Name  
Function  
1 - 2  
3 - 4  
N/C  
RFIN / VG  
N/C  
No Connection  
RF Input / Gate  
No Connection  
RF Output / Drain  
No Connection  
Ground / Source  
Ordering Information  
5 -14  
15 - 16  
17 - 24  
25  
Part Number  
MAGX-011086  
Package  
RFOUT / VD  
N/C  
Paddle2  
Bulk Quantity  
Sample Board  
MAGX-011086-SMBPPR  
1. All no connection pins may be left floating or grounded.  
2. The exposed pad centered on the package bottom must be  
connected to RF and DC ground and provide a low thermal  
resistance heat path.  
*
Restrictions on Hazardous Substances, European Union  
Directive 2011/65/EU.  
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  

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