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MA4P102 PDF预览

MA4P102

更新时间: 2024-11-24 07:20:35
品牌 Logo 应用领域
泰科 - TE 二极管开关微波开关
页数 文件大小 规格书
10页 235K
描述
PIN Diodes for Microwave Switch Designs

MA4P102 数据手册

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AN3021  
Rev. V2  
PIN Diodes for Microwave Switch Designs  
Introduction  
This Application Note is intended to provide practical guidance in the selection of PIN Diodes for switch control  
circuit functions. Switches, Digital and Analog Attenuators, and Limiters each have unique functions that require  
proper device selection. The design difficulty lies within the parametric translation from Diode Specifications, to  
the circuit designers’ Microwave Specifications. Diode parametric language such as Vb, Vf, Ct, Rs, τL, θ, must  
convert into Insertion Loss, VSWR, Isolation, P1dB, Input IP3, RF Operating Power, RF Power Dissipation, and  
D.C. Power Consumption Specification Terminology.  
In addition to actual diode parameters, package parasitics play a significant role in determining switch circuit per-  
formance. Package capacitance, package inductance, package electrical resistance, and package thermal im-  
pedance are extremely important considerations to determine the effective frequency bandwidth and maximum  
incident power for reliable switch operation.  
The manufacturing methodology dictates the type of diode selection. Surface mount assembly will mandate the  
usage of either plastic, HMIC SURMOUNT, or MELF & HiPAX ceramic devices. Chip and Wire ( Hybrid ) manu-  
facturing will determine the usage of Cermachips, Flip Chips, or Beam Lead Devices. Schematics for the most  
common switch designs: Series-Exclusive, Shunt-Exclusive, and Series-Shunt are outlined below for considera-  
tion.  
The Decision Making Process for PIN Diode Selection for Microwave Switch Design  
The following procedure outlines and Effective Process for PIN Diode Selection for Switch Design.  
1. Determine the Preferred Type of Manufacturing for the PIN Diode in the Switch Design: Surface  
Mount or Chip and Wire (Hybrid) Manufacturing.  
2. Determine the Frequency of Operation and RF Power Handling of the Switch Design.  
3. Use Table 1, “Relative Switch Performance and Design Evaluation Matrix” to determine the Type of  
Switch Design that Best Satisfies the Particular Switch Specifications and Requirements.  
4. Use Table 2, “Relative PIN Diode Performance Evaluation Matrix” to Determine the Type of PIN Di-  
ode that Best Satisfies the Switch Design Selected from Table 1.  
5. Use Table 3, “PIN Diode P/N Series Matrix” to Determine the PIN Diode P/N Series that Best Satis-  
fies the Type of PIN Diode Selected from Table 2.  
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
North America Tel: 800.366.2266 Europe Tel: +353.21.244.6400  
is considering for development. Performance is based on target specifications, simulated results,  
India Tel: +91.80.43537383  
China Tel: +86.21.2407.1588  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  

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