MA4P MELF & HIPAX™Series
High Power PIN Diodes
V14
Package Styles
Features
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High Power Handling
Low Loss / Low Distortion
Voltage Ratings up to 1000 Volts
Passivated Chip for Low Leakage Current
Low Theta (θ) Due to Full Face Chip Bonding
Leadless Low Inductance MELF Packages
Various Package Options
Available as Chips
Fully RoHS Compliant
401 & 402
Non-Magnetic Packages Available for MRI
1072 & 1091
Description
Applications
HIPAX PIN diodes are designed for use in a wide
variety of switch and attenuator applications from HF
through UHF frequencies and at power levels above
1kW, CW. The internal chip as well as each diode
assembly has been comprehensively tested and
characterized to ensure predictable and repeatable
performance.
M/A-COM Technology Solutions MELF and HIPAX
PIN diode series are designed for usage in switch
and attenuator applications requiring high power
handling and low distortion. The MELF and HIPAX
PIN diodes incorporate a fully passivated PIN diode
chip resulting in an extremely low reverse bias
leakage current. The semiconductor technology
utilized in the MELF and HIPAX families draws on
M/A-COM Tech’s substantial experience in PIN
diode design and wafer fabrication. The result is a
device which has a thick I-region and long carrier
lifetime while maintaining low series resistance and
capacitance values. The chips of the MELF and
HIPAX PIN diodes are enclosed in a rugged
ceramic package and is full face bonded to metal
pins on both the anode and cathode. The result is a
low loss PIN diode with low thermal resistance due
to symmetrical thermal paths. The parts are offered
in either magnetic or non-magnetic, HIPAX (axial
leaded) or Metal Electrode Leadless Faced (MELF)
surface mount packages for MRI applications. The
MELF is a rectangular SMQ, package which is
designed for high volume tape and reel assembly.
This easy to use package design makes automatic
pick and place, indexing and assembly, extremely
easy. The parallel flat surfaces are suitable for most
key jaw or vacuum pick-up techniques. All of the
solderable surfaces are tin plated and compatible
with industry standard reflow and vapor phase
soldering processes. See page 7 of Application
Note M538 on the M/A-COM Technology Solutions
website for a typical solder reflow profile.
Design Recommendations
♦Low Distortion Attenuators
•MA4P4301B
♦Surface Mount Switches
•MA4P7101F
♦Cellular Radio Antenna Switches
• MA4P1200, MA4P1250
Absolute Maximum Ratings
TAMB = +25°C (Unless Otherwise Noted) 1
Parameter
Absolute Maximum
D.C. Reverse Voltage (VR)
(See Tables)
Operating Chip Junction
Temperature
-55°C to +175°C
Storage Temperature
Installation Temperature
ESD
-55°C to +200°C
+280°C for 30 Seconds
Class 1A, HBM
Notes
1.Operation of this device above any one of these
parameters may cause permanent damage.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
1
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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