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MA4P1450-1091T PDF预览

MA4P1450-1091T

更新时间： 2024-11-25 02:55:43
品牌 Logo 应用领域
MACOM 衰减器开关测试二极管
页数 文件大小 规格书
12页 1650K
描述
MA4P MELF & HIPAX™Series

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中文翻译

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MA4P1450-1091T 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active包装说明：O-CELF-R2
针数：2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.80
风险等级：1.59Is Samacsys：N
其他特性：LOW DISTORTION应用：ATTENUATOR; SWITCHING
最小击穿电压：100 V外壳连接：ISOLATED
配置：SINGLE最大二极管电容：1.2 pF
标称二极管电容：1.8 pF二极管元件材料：SILICON
最大二极管正向电阻：0.75 Ω二极管电阻测试电流：50 mA
二极管电阻测试频率：100 MHz二极管类型：PIN DIODE
频带：HIGH FREQUENCY TO ULTRA HIGH FREQUENCYJESD-30 代码：O-CELF-R2
少数载流子标称寿命：0.008 µs元件数量：1
端子数量：2最高工作温度：175 °C
最低工作温度：-55 °C封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装形状：ROUND封装形式：LONG FORM
峰值回流温度（摄氏度）：NOT SPECIFIED最大功率耗散：10 W
认证状态：Not Qualified反向测试电压：50 V
子类别：PIN Diodes表面贴装：YES
技术：POSITIVE-INTRINSIC-NEGATIVE端子形式：WRAP AROUND
端子位置：END处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

MA4P1450-1091T 数据手册

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MA4P MELF & HIPAX™Series  
High Power PIN Diodes  
V14  
Package Styles  
Features  
♦
♦
♦
♦
♦
♦
♦
♦
♦
♦
High Power Handling  
Low Loss / Low Distortion  
Voltage Ratings up to 1000 Volts  
Passivated Chip for Low Leakage Current  
Low Theta (θ) Due to Full Face Chip Bonding  
Leadless Low Inductance MELF Packages  
Various Package Options  
Available as Chips  
Fully RoHS Compliant  
401 & 402  
Non-Magnetic Packages Available for MRI  
1072 & 1091  
Description  
Applications  
HIPAX PIN diodes are designed for use in a wide  
variety of switch and attenuator applications from HF  
through UHF frequencies and at power levels above  
1kW, CW. The internal chip as well as each diode  
assembly has been comprehensively tested and  
characterized to ensure predictable and repeatable  
performance.  
M/A-COM Technology Solutions MELF and HIPAX  
PIN diode series are designed for usage in switch  
and attenuator applications requiring high power  
handling and low distortion. The MELF and HIPAX  
PIN diodes incorporate a fully passivated PIN diode  
chip resulting in an extremely low reverse bias  
leakage current. The semiconductor technology  
utilized in the MELF and HIPAX families draws on  
M/A-COM Tech’s substantial experience in PIN  
diode design and wafer fabrication. The result is a  
device which has a thick I-region and long carrier  
lifetime while maintaining low series resistance and  
capacitance values. The chips of the MELF and  
HIPAX PIN diodes are enclosed in a rugged  
ceramic package and is full face bonded to metal  
pins on both the anode and cathode. The result is a  
low loss PIN diode with low thermal resistance due  
to symmetrical thermal paths. The parts are offered  
in either magnetic or non-magnetic, HIPAX (axial  
leaded) or Metal Electrode Leadless Faced (MELF)  
surface mount packages for MRI applications. The  
MELF is a rectangular SMQ, package which is  
designed for high volume tape and reel assembly.  
This easy to use package design makes automatic  
pick and place, indexing and assembly, extremely  
easy. The parallel flat surfaces are suitable for most  
key jaw or vacuum pick-up techniques. All of the  
solderable surfaces are tin plated and compatible  
with industry standard reflow and vapor phase  
soldering processes. See page 7 of Application  
Note M538 on the M/A-COM Technology Solutions  
website for a typical solder reflow profile.  
Design Recommendations  
♦Low Distortion Attenuators  
•MA4P4301B  
♦Surface Mount Switches  
•MA4P7101F  
♦Cellular Radio Antenna Switches  
• MA4P1200, MA4P1250  
Absolute Maximum Ratings  
TAMB = +25°C (Unless Otherwise Noted) 1  
Parameter  
Absolute Maximum  
D.C. Reverse Voltage (VR)  
(See Tables)  
Operating Chip Junction  
Temperature  
-55°C to +175°C  
Storage Temperature  
Installation Temperature  
ESD  
-55°C to +200°C  
+280°C for 30 Seconds  
Class 1A, HBM  
Notes  
1.Operation of this device above any one of these  
parameters may cause permanent damage.  
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400  
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions  
is considering for development. Performance is based on target specifications, simulated results,  
and/or prototype measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology  
Solutions has under development. Performance is based on engineering tests. Specifications are  
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.  
Commitment to produce in volume is not guaranteed.  
1
• India Tel: +91.80.4155721  
• China Tel: +86.21.2407.1588  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  
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