Packaged PIN Diodes
RoHS Compliant
Rev V.9
Maximum Power Dissipation
Features
♦ High Power
♦ Fast Speed
Cathode Heatsink Packages
P
=
diss
♦ Voltage Ratings to 1500 Volts
♦ Wide Selection of Carrier Lifetimes
♦ Wide Selection of Capacitances
♦ Assortment of Packages Styles
♦ Available Screened for Military Applications
T (max Operating)-25°C
Thermal Resistance
30,31,32,36,43,94,111,120,
150,255 258,296,1072,1079
Leaded Packages @+25°C
P
P
= 250mW
= 300mW
diss
diss
144, 186, 276,1088
Surface Mount Package +25°C
Description and Applications
1056
M/A-COM's broad line of packaged PIN diodes
encompasses a comprehensive range of electrical
characteristics and package outlines. This diverse union
of semiconductor technology and chip packaging gives
considerable flexibility to the circuit designer. The fast
switching series of packaged PIN diodes utilize a thin
I-region and silicon oxide or glass passivated chips
which provide for low leakage currents and low insertion
loss. Using in process control monitors to regulate wafer
fabrication parameters these devices achieve consistent
performance in control circuit applications. The high
voltage product line of packaged PIN diodes employs
M/A-COM's unique CERMACHIP® passivation process
which provides for a hard glass encapsulation that
hermetically seals the active area of the chip. These
packaged CERMACHIP® PIN diodes are ideally suited
for use in high power applications where high RF
voltages are present. The diode chips are bonded into
sealed ceramic packages that are designed for the most
stringent electrical and environmental conditions. A wide
choice of packages are available which can be mounted
into a variety of microwave and RF circuit media. The
Packaged PIN Diodes series are designed to have a
high inherent reliability and may be ordered screened to
meet many MIL-STD reliability levels.
Co-Axial Packages
31,32,94
36
30, 296
120,255
Leaded/Surface Mount Packages
Thru Hole
1088
276
1072,1079
186
1056
144
Threaded Packages
Absolute Maximum Ratings1
Parameter
Absolution Max.
Voltage
As Specified in Table
- 65°C to +175°C
- 65°C to +200°C
Operating Temperature
Storage Temperature
150
111
43
258
Unpackaged Die
Operating and Storage
(Case Style 1088)
- 65°C to +125°C
1. Operation beyond any one of the above conditions may
cause permanent damage to the device.
Specifications subject to change without prior notification.
131,132.134 , 212
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.