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MA4P1250 PDF预览

MA4P1250

更新时间: 2024-11-23 22:26:43
品牌 Logo 应用领域
泰科 - TE 二极管开关
页数 文件大小 规格书
3页 147K
描述
Surface Mount PIN Diodes

MA4P1250 技术参数

生命周期:Transferred包装说明:R-CDSO-R2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.24
Is Samacsys:N其他特性:LOW DISTORTION
应用:SWITCHING最小击穿电压:50 V
配置:SINGLE最大二极管电容:1.2 pF
二极管元件材料:SILICON最大二极管正向电阻:0.75 Ω
二极管类型:PIN DIODE频带:HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 代码:R-CDSO-R2少数载流子标称寿命:4 µs
元件数量:1端子数量:2
最高工作温度:175 °C最低工作温度:-65 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE最大功率耗散:1.5 W
认证状态:Not Qualified表面贴装:YES
技术:POSITIVE-INTRINSIC-NEGATIVE端子形式:WRAP AROUND
端子位置:DUALBase Number Matches:1

MA4P1250 数据手册

 浏览型号MA4P1250的Datasheet PDF文件第2页浏览型号MA4P1250的Datasheet PDF文件第3页 
Surface Mount  
PIN Diodes  
MA4P1250, MA4P1450 SMQ™  
V3.00  
Features  
Non-Rollable MELF Design  
Hermetically Sealed  
Low Loss, Low Distortion  
Passivated PIN Diode Chips  
Full Face Chip Bonds  
Non-Magnetic Package  
Pick and Place Compatibility  
Size, Inches (mm)  
Description  
Case  
Style  
A(sq.)  
B
C
The MA4P1250 and MA4P1450 are square surface mount-  
able PIN diodes in a non-rollable, metal electrode lead-  
less faced (MELF) package. They incorporate passivated  
PIN diode chips that are full face bonded to refractory  
metal pins. These parts utilize M/A-COM’s HIPAX tech-  
nology in a low inductance ceramic package with no rib-  
bons or whisker wires. The package is hermetically  
sealed at temperatures exceeding 300˚C.  
Model No.  
MA4P1250  
Min./Max.  
Min./Max.  
Min./Max.  
0.080/0.095 0.115/0.135  
(2.03/2.41) (2.92/3.43)  
0.138/0.155 0.180/0.200  
(3.51/3.94) (4.57/5/08)  
1072  
1091  
0.008/0.030  
(0.203/0.762)  
MA4P1450  
PASSIVATED  
PIN DIODE CHIP  
FULL FACE  
BOND  
Applications  
The MA4P1250 is designed for use as a low loss switch-  
ing element from HF through UHF. Its high power rating  
allows performance in antenna switch elements at RF  
power levels greater than 100 watts CW. It is designed to  
meet the low distortion requirements of mobile radios.  
The MA4P1450 is a higher power diode. It has lower dis-  
tortion at RF CW power greater than 10 watts and can  
dissipate 7.5 watts.  
CERAMIC  
Designed for Automated Assembly  
These surface mount PIN diodes are designed for high  
volume tape and reel assembly. The square package  
eases automatic pick and place indexing and assembly.  
The parallel flat surfaces are suitable for key jaw or vac-  
uum pickup techniques. All solderable surfaces are tin  
plated and compatible with reflow and vapor phase sol-  
dering methods.  
SOLDERABLE  
SURFACES  
Environmental Capability  
These HIPAX diodes are applicable for use in industrial  
and military applications. They can meet the environmen-  
tal requirements of MIL-STD-750 and MIL-STD-202 or be  
screened to JAN-TX and other high reliability standards.  
SMQ is a trademark of M/A-COM, Inc.  
Specifications Subject to Change Without Notice.  
M/A-COM, Inc.  
1
North America: Tel. (800) 366-2266  
Fax (800) 618-8883  
Asia/Pacific: Tel. +81 3 3263 8761  
Fax +81 3 3263 8769  
Europe: Tel. +44 (1344) 869 595  
Fax +44 (1344) 300 020  

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