Datasheet > MA4P1450

MA4P1450

更新时间： 2024-11-04 22:26:43

品牌	Logo	应用领域
泰科 - TE		二极管开关
页数	文件大小	规格书
3页	147K
描述
Surface Mount PIN Diodes

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技术参数
数据手册

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MA4P1450 技术参数

生命周期：	Transferred	包装说明：	R-CDSO-R2
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8541.10.00.80	风险等级：	5.24
Is Samacsys：	N	其他特性：	LOW DISTORTION
应用：	SWITCHING	最小击穿电压：	50 V
配置：	SINGLE	最大二极管电容：	2.5 pF
二极管元件材料：	SILICON	最大二极管正向电阻：	0.75 Ω
二极管类型：	PIN DIODE	频带：	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 代码：	R-CDSO-R2	少数载流子标称寿命：	6 µs
元件数量：	1	端子数量：	2
封装主体材料：	CERAMIC, METAL-SEALED COFIRED	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	最大功率耗散：	1.5 W
认证状态：	Not Qualified	表面贴装：	YES
技术：	POSITIVE-INTRINSIC-NEGATIVE	端子形式：	WRAP AROUND
端子位置：	DUAL	Base Number Matches：	1

MA4P1450 数据手册

Surface Mount

PIN Diodes

MA4P1250, MA4P1450 SMQ™

V3.00

Features

●

Non-Rollable MELF Design

●

Hermetically Sealed

●

Low Loss, Low Distortion

●

Passivated PIN Diode Chips

●

Full Face Chip Bonds

●

Non-Magnetic Package

●

Pick and Place Compatibility

Size, Inches (mm)

Description

Case

Style

A(sq.)

The MA4P1250 and MA4P1450 are square surface mount-

able PIN diodes in a non-rollable, metal electrode lead-

less faced (MELF) package. They incorporate passivated

PIN diode chips that are full face bonded to refractory

metal pins. These parts utilize M/A-COM’s HIPAX tech-

nology in a low inductance ceramic package with no rib-

bons or whisker wires. The package is hermetically

sealed at temperatures exceeding 300˚C.

Model No.

MA4P1250

Min./Max.

0.080/0.095 0.115/0.135

(2.03/2.41) (2.92/3.43)

0.138/0.155 0.180/0.200

(3.51/3.94) (4.57/5/08)

1072

1091

0.008/0.030

(0.203/0.762)

MA4P1450

PASSIVATED

PIN DIODE CHIP

FULL FACE

BOND

Applications

The MA4P1250 is designed for use as a low loss switch-

ing element from HF through UHF. Its high power rating

allows performance in antenna switch elements at RF

power levels greater than 100 watts CW. It is designed to

meet the low distortion requirements of mobile radios.

The MA4P1450 is a higher power diode. It has lower dis-

tortion at RF CW power greater than 10 watts and can

dissipate 7.5 watts.

CERAMIC

Designed for Automated Assembly

These surface mount PIN diodes are designed for high

volume tape and reel assembly. The square package

eases automatic pick and place indexing and assembly.

The parallel ﬂat surfaces are suitable for key jaw or vac-

uum pickup techniques. All solderable surfaces are tin

plated and compatible with reﬂow and vapor phase sol-

dering methods.

SOLDERABLE

SURFACES

Environmental Capability

These HIPAX diodes are applicable for use in industrial

and military applications. They can meet the environmen-

tal requirements of MIL-STD-750 and MIL-STD-202 or be

screened to JAN-TX and other high reliability standards.

SMQ is a trademark of M/A-COM, Inc.

Speciﬁcations Subject to Change Without Notice.

M/A-COM, Inc.

North America: Tel. (800) 366-2266

Fax (800) 618-8883

■

Asia/Paciﬁc: Tel. +81 3 3263 8761

Fax +81 3 3263 8769

■

Europe: Tel. +44 (1344) 869 595

Fax +44 (1344) 300 020

12 3

中文翻译

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与MA4P1450相关器件

型号	品牌	获取价格	描述	数据表
MA4P1450-1091T	TE	获取价格	High Power PIN Diodes
MA4P1450-1091T	MACOM	获取价格	MA4P MELF & HIPAXâ¢Series
MA4P150	TE	获取价格	PIN Diode Chips
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MA4P154	TE	获取价格	PIN Diode Chips
MA4P155	TE	获取价格	PIN Diode Chips
MA4P156	TE	获取价格	PIN Diode Chips
MA4P157	TE	获取价格	PIN Diode Chips

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