LX5530
®
InGaP HBT 4.5 – 6.0GHz Power Amplifier
TM
PRODUCTION DATA SHEET
KEY FEATURES
DESCRIPTION
Broadband 4.9 – 5.9GHz
Operation
Advanced InGaP HBT
Single-Polarity 3 – 5V Supply
Power Gain up to ~ 33dB for
VC=5V, Icq = 250mA
Power Gain > ~28dB across 4.9-
5.85GHz
OFDM Mask Compliance Power
Pout ~ +25dBm over 4.9-
5.85GHz (ACPR ~ -50dBc @
±30MHz Offset)
Pout up to +23dBm with EVM
~3% (VC = 5V)
EVM < ~2.5% for
Pout=+21dBm across 4.9-
5.85GHz (VC = 5V)
EVM < ~2.5% for
Pout=+19dBm across 4.9-
5.85GHz (VC = 4V)
Total Current ~250mA for Pout =
+20dBm, Duty Cycle = 99%
(VC= 4V)
Complete On-Chip Input Match
Simple Output Match for Optimal
Broadband EVM
The LX5530 is a power amplifier
The LX5530 also features an on-chip
optimized for the FCC Unlicensed power detector at the output port of the
National Information Infrastructure PA to help reduce BOM cost and PCB
(U-NII) band, HyperLAN2 and Japan space for implementation of power
WLAN applications in the 4.9 – 5.9 control in a typical wireless system. The
GHz frequency range. The PA is power detector is integrated with a
implemented as a three-stage monolithic temperature-compensated bias network
microwave integrated circuit (MMIC) and provides very stable response
with active bias, on-chip input across a wide range of output power
matching and output pre-matching. levels, over temperature extremes from
The device is manufactured with an -40 to +85°C.
InGaP/GaAs Heterojunction Bipolar
Transistor (HBT) IC process 3mmx3mm micro-lead package (MLP).
The LX5530 is available in a 16-pin
(MOCVD). It operates with a single The compact footprint, low profile, and
positive voltage supply of 3 – 5V, excellent thermal capability makes the
with high power gain of up to 33dB. LX5530 an ideal solution for
When operated at 5V supply voltage, broadband, high-gain power amplifier
it provides up to +25dBm linear requirements for IEEE 802.11a, and
output power for 802.11a OFDM Hiperlan2 portable WLAN, as well as
spectrum mask compliance, and low the
EVM of 3% for up to +23dBm output applications.
power in the 4.9-5.9GHz band.
emerging
802.16
WiMAX
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
On-Chip RF Decoupling
Temperature-Compensated On-
Chip Output Power Detector
with Wide Dynamic Range
Small Footprint: 3x3mm
Low Profile: 0.9mm
BLOCK DIAGRAM
Vc
APPLICATIONS
RF
Input
RF
Output
FCC U-NII Wireless
IEEE 802.11a
HiperLAN2
5GHz Cordless Phone
IEEE 802.16 WiMAX
Active Bias Network
Vref
Det
3X3MM MLP PACKAGE
PACKAGE ORDER INFO
Plastic MLPQ
16 pin
LQ
MSC
5530
608Y
RoHS Compliant / Pb-free
LX5530LQ
Note: Available in Tape & Reel. Append the letters
“TR” to the part number. (i.e. LX5530LQ-TR)
Copyright © 2000
Rev. 1.0a, 2006-09-12
Microsemi
Page 1
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570