LX5553
®
2.4-2.5 GHz Front-End Module with Internally
TM
Matched Power Amplifier, LNA & SP3T Switch
PRODUCTION DATA SHEET
K E Y F E A T U R E S
D E S C R I P T I O N
LX5553 is a high-integration, high- provides about 25dB power gain, and
performance WLAN front-end module +17dBm linear output power, with
(FEM) for 802.11b/g/n and other EVM (<3%) for 64QAM/ 54Mbps
applications in the 2.4-2.5GHz OFDM. Both gain and power are
frequency range. LX5553 integrates readily measured at antenna port, with
an advanced InGaP/GaAs Hetero- the insertion loss of the SP3T switch
junction Bipolar Transistor (HBT) included.
. 2.4-2.5GHz 802.11b/g/n Front-
End Solution in a Single MLP
Package
. SP3T for Sharing Antenna
between WLAN and Bluetooth
systems
. All RF I/O Matched to 50
. Single-Supply Voltage 3.0V to
4.2V
power amplifier with on chip
The Rx path of LX5553 features
impedance matching, a fully matched 13dB small-signal gain, noise figure of
low noise amplifier based on InGaAs 2.1dB, and high input referred third-
Enhancement mode pseudo-morphic order harmonic intercept point (IIP3) of
high electron mobility transistor (E- +5dBm, including the SP3T switch loss.
pHEMT) technology, and a Depletion The LNA consumes about 11mA
mode pHEMT (D-pHEMT) single- current with a single 3.6V supply.
. Small Footprint: 3x3mm2
. Low Profile: 0.55mm
. RoHS Compliant & Pb-Free
TX Features :
. Power Gain ~ 25 dB*
. Pout ~ +17 dBm* for 3% EVM at
Antenna
. Current ~145 mA at +17 dBm*
. Pout ~ +21 dBm* for 11b 1Mbps
DSSS Mask Compliance
. Quiescent Current ~ 82 mA
pole triple-throw (SP3T) switch, all
The Bluetooth path of LX5553
into a single package with 3x3mm features low insertion loss of 0.9dB and
footprint. LX5553 provides capability high input referred 1dB gain
of sharing a single antenna between compression point (IP1dB) of +29dBm.
WLAN and Bluetooth systems
through the SP3T switch.
LX5553 is available in a 16-pin, low
profile of 0.55mm, 3x3mm2 micro-lead
The Tx path of LX5553 features a package (MLPQ-16L) in very low
two-stage monolithic microwave profile of 0.55mm. With its high level
integrated circuit (MMIC) power of functional integration, best-class
amplifier with active bias circuitry, performance, compact footprint and low
on-chip output power detector, and profile, LX5553 offers an ideal front-
RX Features :
. Gain ~ 13 dB*
. Noise Figure ~ 2.1 dB*
. IIP3 ~ +5 dBm*
end solution for the ever demanding
design requirements of today’s highly
integrated mobile equipments, including
802.11b/g/n and Bluetooth applications.
50 input/output matching inside the
package. With 3.6V supply voltage
and 82mA bias current, the Tx path
Bluetooth Path :
. Insertion Loss ~ 0.9 dB
. IP1dB ~ +29 dBm
* Including SP3T switch loss
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
A P P L I C A T I O N S
. IEEE 802.11b/g/n
. Mobile Phone WLAN module
B L O C K D I A G R A M
PAOut/
Vc2
Vref Vc1
SwIn
IMN*
PA
OMN*
TxIn
Det
Antenna
Port
LNAOut
Vdd
LNA
BT
*IMN:
Input Matching Network
*OMN:
CtrlTx / CtrlRx / CtrlBT
Output Matching Network
Copyright 2010
Rev. 1.0, 2010-03-18
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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