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LX5552LU PDF预览

LX5552LU

更新时间: 2024-11-11 05:44:23
品牌 Logo 应用领域
美高森美 - MICROSEMI 开关放大器功率放大器光电二极管
页数 文件大小 规格书
3页 92K
描述
2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SPDT Switch

LX5552LU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFN
包装说明:QCCN,针数:16
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.47JESD-30 代码:S-PQCC-N16
JESD-609代码:e3长度:3 mm
湿度敏感等级:1功能数量:1
端子数量:16最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:QCCN封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):260
认证状态:Not Qualified标称供电电压:3.3 V
表面贴装:YES技术:BIPOLAR
电信集成电路类型:RF FRONT END CIRCUIT温度等级:INDUSTRIAL
端子面层:MATTE TIN端子形式:NO LEAD
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:3 mmBase Number Matches:1

LX5552LU 数据手册

 浏览型号LX5552LU的Datasheet PDF文件第2页浏览型号LX5552LU的Datasheet PDF文件第3页 
LX5552  
®
2.4-2.5 GHz Front-End Module with Internally  
TM  
Matched Power Amplifier, LNA & SPDT Switch  
PRODUCTION DATA SHEET  
KEY FEATURES  
DESCRIPTION  
LX5552 is a high-integration, high- +17dBm linear output power, with low  
performance WLAN front-end module total EVM (<3%) for 64QAM/ 54Mbps  
(FEM) for 802.11b/g/n and other OFDM. Both gain and power are  
applications in the 2.4-2.5GHz readily measured at antenna port with  
frequency range. LX5552 integrates a the insertion loss of the Tx switch  
fully matched InGaP/GaAs Hetero- included.  
ƒ 2.4-2.5GHz 802.11b/g/n Front-  
End Solution in a Single MLP  
Package  
ƒ All RF I/O Matched to 50 Ω  
ƒ Single-Polarity 3.3V Supply  
ƒ Small Footprint: 3x3mm2  
ƒ Low Profile: 0.55mm  
junction Bipolar Transistor (HBT)  
The Rx path of LX5552 features  
power amplifier, a low noise amplifier small-signal gain of 12.5dB, low noise  
based on InGaAs Enhancement mode figure of 2dB, and high input third-  
ƒ RoHS Compliant & Pb-Free  
pseudo-morphic  
mobility transistor  
technology, and a low-cost Depletion switch loss included. The LNA  
mode pHEMT (D-pHEMT) single consumes about 10mA current with  
pole double throw (SPDT) antenna 3.3V supply voltage.  
high  
electron order intercept point (IIP3) of +5dBm  
(E-pHEMT) with the insertion loss of the the Rx  
TX Features :  
ƒ Power Gain ~ 26dB*  
ƒ Pout ~ +17dBm* for 3% EVM  
ƒ Current ~140mA at +17dBm  
ƒ Pout ~ +21dBm* for 11b  
1Mbps DSSS Mask  
switch in a single package.  
LX5552 is available in a 16-pin,  
The Tx path of LX5552 features a 3x3mm micro-lead package (MLPQ-  
two-stage monolithic microwave 16L). With its high level of functional  
integrated circuit (MMIC) power integration, best-class performance,  
amplifier with active bias circuitry, compact footprint and low profile,  
on-chip output power detector, and LX5552 offers an ideal front-end  
Compliance  
ƒ Quiescent Current ~ 80mA  
RX Features :  
ƒ Gain ~ 12.5dB*  
ƒ Noise Figure ~ 2dB*  
ƒ IIP3 ~ +5dBm*  
solution for the ever demanding design  
requirements of today’s WLAN  
systems, including 802.11b/g and the  
latest 11n MIMO applications.  
50Ω input/output matching inside the  
package. With 3.3V supply voltage  
and 80mA bias current, the Tx path  
provides about 26dB power gain and  
* Including SPDT switch loss  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
APPLICATIONS  
ƒ IEEE 802.11b/g  
ƒ IEEE 802.11n MIMO  
BLOCK DIAGRAM  
PA  
Vref Vc1  
Vc2  
SwIn  
Out  
IMN*  
OMN*  
PA  
TxIn  
Det  
Antenna  
Port  
LNA  
RxOut  
*IMN:  
Input Matching Network  
*OMN:  
Output Matching Network  
CtrlTx  
CtrlRx  
Vdd  
Copyright © 2009  
Rev. 1.0, 2009-06-02  
Microsemi  
Analog Mixed Signal Group  
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570  
Page 1  

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