是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 包装说明: | HVQCCN, LCC32,.2SQ,20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 12 weeks |
风险等级: | 5.51 | 其他特性: | ALSO OPERATES WITH SUPPLY VOLTAGE 4.5 TO 6V |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | S-XQCC-N32 | JESD-609代码: | e3 |
长度: | 5 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 32 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电流: | 0.3 A |
最大输出电压: | 3.3 V | 最小输出电压: | 1.5 V |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装等效代码: | LCC32,.2SQ,20 | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
电源: | 3.6 V | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Power Management Circuits |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.6 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 5 mm |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LP3923 | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TL | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TL | NSC |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA30, 3 X 2.50 MM, MICRO SMD-30, Power Management | |
LP3923TL-VB | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TL-VB | NSC |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA30, 3 X 2.50 MM, MICRO SMD-30, Power Management | |
LP3923TL-VC | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TL-VC/NOPB | TI |
获取价格 |
Cellular Phone Power Management IC (PMIC) 30-DSBGA | |
LP3923TL-VI | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TL-VI | NSC |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA30, 3 X 2.50 MM, MICRO SMD-30, Power Management | |
LP3923TL-VI/NOPB | TI |
获取价格 |
Cellular Phone Power Management IC (PMIC) 30-DSBGA -40 to 125 |