是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 包装说明: | VFBGA, BGA30,5X6,20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.68 |
其他特性: | ALSO REQUIRE OPERATING VOLTAGE CHG_IN 4.5V TO 6.8V | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-PBGA-B30 |
JESD-609代码: | e1 | 长度: | 2.96 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 30 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA30,5X6,20 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 3.6 V | 认证状态: | Not Qualified |
座面最大高度: | 0.675 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.4 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 3.6 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2.46 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LP3923TLX-VI | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TLX-VI | NSC |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA30, 3 X 2.50 MM, MICRO SMD-30, Power Management | |
LP3923TLX-VI/NOPB | TI |
获取价格 |
Cellular Phone Power Management IC (PMIC) 30-DSBGA | |
LP3925 | TI |
获取价格 |
High Performance Power Management Unit for Handset Applications | |
LP3925RME-A/NOPB | TI |
获取价格 |
High Performance Power Management Unit for Handset Applications | |
LP3925RME-E/NOPB | TI |
获取价格 |
High Performance Power Management Unit for Handset Applications | |
LP3925RMX-A/NOPB | TI |
获取价格 |
High Performance Power Management Unit for Handset Applications | |
LP3925RMX-E/NOPB | TI |
获取价格 |
High Performance Power Management Unit for Handset Applications | |
LP3927 | NSC |
获取价格 |
Cellular/PCS System Power Management IC | |
LP3927ILQ-AH | NSC |
获取价格 |
Cellular/PCS System Power Management IC |