生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 3 X 2.50 MM, MICRO SMD-30 | 针数: | 30 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.68 |
Is Samacsys: | N | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-PBGA-B30 |
长度: | 2.974 mm | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 30 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
认证状态: | Not Qualified | 座面最大高度: | 0.675 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.6 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
宽度: | 2.466 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
LP3923TL-VC | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TL-VC/NOPB | TI |
获取价格 |
Cellular Phone Power Management IC (PMIC) 30-DSBGA | |
LP3923TL-VI | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TL-VI | NSC |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA30, 3 X 2.50 MM, MICRO SMD-30, Power Management | |
LP3923TL-VI/NOPB | TI |
获取价格 |
Cellular Phone Power Management IC (PMIC) 30-DSBGA -40 to 125 | |
LP3923TLX | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TLX | NSC |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA30, 3 X 2.50 MM, MICRO SMD-30, Power Management | |
LP3923TLX-VB | TI |
获取价格 |
Cellular Phone Power Management Unit | |
LP3923TLX-VB | NSC |
获取价格 |
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA30, 3 X 2.50 MM, MICRO SMD-30, Power Management | |
LP3923TLX-VB/NOPB | TI |
获取价格 |
Cellular Phone Power Management IC (PMIC) 30-DSBGA -40 to 125 |