是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | VFBGA, BGA62,12X9,40/32 |
针数: | 62 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.24 |
风险等级: | 5.92 | 访问模式: | BLOCK ORIENTED PROTOCOL |
其他特性: | SELF REFRESH | 最大时钟频率 (fCLK): | 600 MHz |
I/O 类型: | COMMON | JESD-30 代码: | R-PBGA-B62 |
JESD-609代码: | e0 | 长度: | 13.15 mm |
内存密度: | 150994944 bit | 内存集成电路类型: | RAMBUS DRAM |
内存宽度: | 18 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 62 |
字数: | 8388608 words | 字数代码: | 8000000 |
工作模式: | ASYNCHRONOUS | 组织: | 8MX18 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA62,12X9,40/32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 1.8/2.5,2.5 V |
认证状态: | Not Qualified | 刷新周期: | 16384 |
座面最大高度: | 1 mm | 自我刷新: | YES |
子类别: | DRAMs | 最大供电电压 (Vsup): | 2.63 V |
最小供电电压 (Vsup): | 2.37 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 12.6 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
KM418RD8C-RK80 | SAMSUNG |
获取价格 |
Rambus DRAM, 8MX18, CMOS, PBGA62, CSP, MICRO, BGA-62 | |
KM418RD8C-RM80 | SAMSUNG |
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Rambus DRAM, 8MX18, CMOS, PBGA62, CSP, MICRO, BGA-62 | |
KM418RD8C-SG60 | SAMSUNG |
获取价格 |
Rambus DRAM, 8MX18, CMOS, PBGA62, CSP, MICRO, BGA-62 | |
KM418RD8C-SK80 | SAMSUNG |
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Rambus DRAM, 8MX18, CMOS, PBGA62, CSP, MICRO, BGA-62 | |
KM418RD8C-SM80 | SAMSUNG |
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Rambus DRAM, 8MX18, CMOS, PBGA62, CSP, MICRO, BGA-62 | |
KM418RD8D | SAMSUNG |
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128/144Mbit RDRAM 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM | |
KM418V256AJ-8 | SAMSUNG |
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Fast Page DRAM, 256KX18, 80ns, CMOS, PDSO40, PLASTIC, SOJ-40 | |
KM418V256ALJ-7 | SAMSUNG |
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Fast Page DRAM, 256KX18, 70ns, CMOS, PDSO40, PLASTIC, SOJ-40 | |
KM418V256ALLJ-7 | SAMSUNG |
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Fast Page DRAM, 256KX18, 70ns, CMOS, PDSO40, PLASTIC, SOJ-40 | |
KM418V256ALLJ-8 | SAMSUNG |
获取价格 |
Fast Page DRAM, 256KX18, 80ns, CMOS, PDSO40, PLASTIC, SOJ-40 |