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K8P3315UQB-PC4DT PDF预览

K8P3315UQB-PC4DT

更新时间: 2024-11-12 05:36:27
品牌 Logo 应用领域
三星 - SAMSUNG 光电二极管内存集成电路闪存
页数 文件大小 规格书
53页 1324K
描述
Flash, 2MX16, 70ns, PDSO48,

K8P3315UQB-PC4DT 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:TSSOP, TSSOP48,.8,20Reach Compliance Code:compliant
风险等级:5.8最长访问时间:70 ns
启动块:BOTTOM/TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PDSO-G48内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:16
部门数/规模:16,62端子数量:48
字数:2097152 words字数代码:2000000
最高工作温度:70 °C最低工作温度:
组织:2MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP48,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小:8 words并行/串行:PARALLEL
电源:3/3.3 V认证状态:Not Qualified
就绪/忙碌:YES部门规模:4K,32K
最大待机电流:0.00003 A子类别:Flash Memories
最大压摆率:0.055 mA表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL切换位:YES
类型:NOR TYPEBase Number Matches:1

K8P3315UQB-PC4DT 数据手册

 浏览型号K8P3315UQB-PC4DT的Datasheet PDF文件第2页浏览型号K8P3315UQB-PC4DT的Datasheet PDF文件第3页浏览型号K8P3315UQB-PC4DT的Datasheet PDF文件第4页浏览型号K8P3315UQB-PC4DT的Datasheet PDF文件第5页浏览型号K8P3315UQB-PC4DT的Datasheet PDF文件第6页浏览型号K8P3315UQB-PC4DT的Datasheet PDF文件第7页 
K8P3315UQB  
FLASH MEMORY  
32Mb B-die Page NOR Specification  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
1
Revision 1.0  
December 2007  

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