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K7N801845M PDF预览

K7N801845M

更新时间: 2024-11-19 03:09:23
品牌 Logo 应用领域
三星 - SAMSUNG /
页数 文件大小 规格书
18页 399K
描述
256K X 36 & 512K X 18 PIPELINED N-T RAM - TM

K7N801845M 数据手册

 浏览型号K7N801845M的Datasheet PDF文件第2页浏览型号K7N801845M的Datasheet PDF文件第3页浏览型号K7N801845M的Datasheet PDF文件第4页浏览型号K7N801845M的Datasheet PDF文件第5页浏览型号K7N801845M的Datasheet PDF文件第6页浏览型号K7N801845M的Datasheet PDF文件第7页 
K7N803645M  
K7N801845M  
256Kx36 & 512Kx18 Pipelined NtRAMTM  
Document Title  
256Kx36 & 512Kx18-Bit Pipelined NtRAMTM  
Revision History  
History  
Rev.No.  
Draft Date  
Remark  
1. Initial document.  
0.0  
September. 1997  
Preliminary  
1. Changed speed bin from 167MHz to 150MHz  
2. Changed DC Parameters;  
0.1  
November. 1997  
Preliminary  
ICC : from 400mA to 450mA , ISB : from 60mA to 20mA  
ISB2 : from 50mA to 85mA  
1. Changed speed bin from 150MHz to 167MHz  
2. Changed Power from 3.3V to 2.5V  
0.2  
March. 11. 1998  
Preliminary  
3. Changed N.C pins to Power and ZZ Pin #14, #16, #64, #66  
4. Changed some control pin names.  
from CEN to CKE, from BWEx to BWx  
5. Modify absolute maximum ratings  
VDD ; from 4.0V to 3.6V, VIN ; from 4.6V to 3.6V  
6. Changed DC parameters  
ISB ; from 20mA to 80mA, ISB2 ; from 85mA to 10mA  
VOL ; from 0.4V to 0.2V, VOH ; from 2.4V to 2.0V  
VIL ; from 0.8V to 0.7V, VIH ; from 2.0V to 1.7V  
7. ADD the sleep mode timing and characteristics  
CKE controlled timing and CS controlled timing  
1. Removed speed bin 167MHz  
0.3  
April. 11. 1998  
Preliminary  
2.Changed AC parameters  
tHZOE ; from 4.0 to 3.5 , tHZC;from 4.0 to 3.5 at -75  
tHZOE ; from 5.0 to 3.5 , tHZC;from 5.0 to 3.5 , tCL/H; 4.0 to 3.0 at -10  
3.Modify Sleep Mode Waveform.  
Changed Sleep Mode Electrical Characteristics .  
tPDS ;from Max 2cycle to Min 2cycle  
tPUS ; from Max 2cycle to Min 2cycle  
1.Modify from ADV to ADV at timing.  
0.4  
0.5  
June. 02. 1998  
Aug. 19. 1998  
Preliminary  
Preliminary  
2.ADD the Trade Mark( NtRAMTM  
)
1. Changed DC parameters  
ISB1; from 10mA to 20mA, ISB2 ; from 10mA to 20mA  
1. Changed tCD,tOE from 4.0ns to 4.2ns at -75.  
0.6  
0.7  
Sep. 28. 1998  
Nov. 10. 1998  
Preliminary  
Preliminary  
1. Changed DC condition at Icc and parameters  
ICC ; from 420mA to 320mA at -67 , from 370mA to 300mA at -75  
from 300mA to 250mA at -10.  
ISB ; from 70mA to 60mA at -67 , from 60mA to 50mA at -75  
from 50mA to 40mA at -10.  
1.Changed VOL Max value from 0.2V to 0.4V .  
1. Add 119BGA(7x17 Ball Grid Array Package) .  
1. Final spec release  
0.8  
0.9  
1.0  
2.0  
Dec. 23. 1998  
Mar. 03. 1999  
April. 01. 1999  
Oct. 30. 1999  
Preliminary  
Preliminary  
Final  
1. Add tCYC 167Mhz.  
Final  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
- 1 -  
November 1999  
Rev 3.0  

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