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K7N163645A-QC16 PDF预览

K7N163645A-QC16

更新时间: 2024-01-20 03:55:04
品牌 Logo 应用领域
三星 - SAMSUNG 时钟静态存储器内存集成电路
页数 文件大小 规格书
24页 280K
描述
ZBT SRAM, 512KX36, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

K7N163645A-QC16 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP, QFP100,.63X.87
针数:100Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.31最长访问时间:3.5 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):167 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:18874368 bit内存集成电路类型:ZBT SRAM
内存宽度:36功能数量:1
端子数量:100字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.5 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.06 A最小待机电流:2.38 V
子类别:SRAMs最大压摆率:0.35 mA
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

K7N163645A-QC16 数据手册

 浏览型号K7N163645A-QC16的Datasheet PDF文件第2页浏览型号K7N163645A-QC16的Datasheet PDF文件第3页浏览型号K7N163645A-QC16的Datasheet PDF文件第4页浏览型号K7N163645A-QC16的Datasheet PDF文件第5页浏览型号K7N163645A-QC16的Datasheet PDF文件第6页浏览型号K7N163645A-QC16的Datasheet PDF文件第7页 
K7N163645A  
K7N161845A  
512Kx36 & 1Mx18 Pipelined NtRAMTM  
Document Title  
512Kx36 & 1Mx18-Bit Pipelined NtRAMTM  
Revision History  
Draft Date  
Remark  
Rev. No.  
History  
Preliminary  
Preliminary  
Preliminary  
Feb. 23. 2001  
May. 10. 2001  
Aug. 30. 2001  
0.0  
0.1  
0.2  
1. Initial document.  
1. Add JTAG Scan Order  
1. Add x32 org and industrial temperature .  
2. Add 165FBGA package  
Preliminary  
Dec. 26. 2001  
0.3  
1. Speed bin merge.  
From K7N1636(32/18)49A to K7N1636(32/18)45A.  
2. AC parameter change.  
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25  
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22  
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20  
Final  
Final  
May. 10. 2002  
May. 22. 2002  
1.0  
2.0  
Final spec release  
Release Icc on page 14.  
part #  
-25  
From  
440  
400  
370  
340  
280  
To  
470  
430  
400  
350  
290  
-22  
-20  
-16  
-13  
Final  
Final  
April 04. 2003  
Nov. 17, 2003  
2.1  
3.0  
1. Delete 119BGA package.  
2. Correct the Ball Size of 165 FBGA.  
1. Delete x32 Org.  
2. Delete the 225MHz speed bin  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
Nov. 2003  
Rev 3.0  
- 1 -  

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