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K7N163645A-QI220 PDF预览

K7N163645A-QI220

更新时间: 2024-02-23 20:29:02
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
28页 322K
描述
ZBT SRAM, 512KX36, 2.8ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

K7N163645A-QI220 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP,
针数:100Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.91最长访问时间:2.8 ns
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:18874368 bit内存集成电路类型:ZBT SRAM
内存宽度:36功能数量:1
端子数量:100字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX36封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):230认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):2.625 V
最小供电电压 (Vsup):2.375 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:14 mmBase Number Matches:1

K7N163645A-QI220 数据手册

 浏览型号K7N163645A-QI220的Datasheet PDF文件第2页浏览型号K7N163645A-QI220的Datasheet PDF文件第3页浏览型号K7N163645A-QI220的Datasheet PDF文件第4页浏览型号K7N163645A-QI220的Datasheet PDF文件第5页浏览型号K7N163645A-QI220的Datasheet PDF文件第6页浏览型号K7N163645A-QI220的Datasheet PDF文件第7页 
K7N163645A  
K7N163245A  
K7N161845A  
512Kx36/32 & 1Mx18 Pipelined NtRAMTM  
Document Title  
512Kx36/32 & 1Mx18-Bit Pipelined NtRAMTM  
Revision History  
Draft Date  
Remark  
Rev. No.  
History  
Preliminary  
Preliminary  
Preliminary  
Feb. 23. 2001  
May. 10. 2001  
Aug. 30. 2001  
0.0  
0.1  
0.2  
1. Initial document.  
1. Add JTAG Scan Order  
1. Add x32 org and industrial temperature .  
2. Add 165FBGA package  
Preliminary  
Dec. 26. 2001  
0.3  
1. Speed bin merge.  
From K7N1636(32/18)49A to K7N1636(32/18)45A.  
2. AC parameter change.  
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25  
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22  
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20  
Final  
Final  
May. 10. 2002  
May. 22. 2002  
1.0  
2.0  
Final spec release  
Release Icc on page 14.  
part #  
-25  
From  
440  
400  
370  
340  
280  
To  
470  
430  
400  
350  
290  
-22  
-20  
-16  
-13  
Final  
April 04. 2003  
2.1  
1. Delete 119BGA package.  
2. Correct the Ball Size of 165 FBGA.  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
April 2003  
Rev 2.1  
- 1 -  

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ZBT SRAM, 512KX36, 5ns, CMOS, PBGA119, BGA-119