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K4T51163QG-HCE6 PDF预览

K4T51163QG-HCE6

更新时间: 2024-09-21 15:36:03
品牌 Logo 应用领域
三星 - SAMSUNG 时钟动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
47页 1021K
描述
DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84,

K4T51163QG-HCE6 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.79最长访问时间:0.45 ns
最大时钟频率 (fCLK):333 MHzI/O 类型:COMMON
交错的突发长度:4,8JESD-30 代码:R-PBGA-B84
JESD-609代码:e1内存密度:536870912 bit
内存集成电路类型:DDR DRAM内存宽度:16
湿度敏感等级:3端子数量:84
字数:33554432 words字数代码:32000000
最高工作温度:95 °C最低工作温度:
组织:32MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA84,9X15,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH峰值回流温度(摄氏度):260
电源:1.8 V认证状态:Not Qualified
刷新周期:8192连续突发长度:4,8
最大待机电流:0.008 A子类别:DRAMs
最大压摆率:0.235 mA标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

K4T51163QG-HCE6 数据手册

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K4T51043QG  
K4T51083QG  
K4T51163QG  
DDR2 SDRAM  
512Mb G-die DDR2 SDRAM Specification  
60FBGA & 84FBGA with Lead-Free and Halogen-Free  
(RoHS compliant)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE  
CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER-  
WISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOL-  
OGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT  
GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.4 December 2008  
1 of 47  

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