M366S3253DTS
PC133/PC100 Unbuffered DIMM
M366S3253DTS SDRAM DIMM
32Mx64 SDRAM DIMM based on 32Mx8, 4Banks, 8K Refresh, 3.3V Synchronous DRAMs with SPD
FEATURE
GENERAL DESCRIPTION
• Performance range
1 The Samsung M366S3253DTS is a 32M bit x 64 Synchronous
Dynamic RAM high density memory module. The Samsung
M366S325DCTS consists of eight CMOS 32M x 8 bit with 4banks
Synchronous DRAMs in TSOP-II 400mil package and a 2K
EEPROM in 8-pin TSSOP package on a 168-pin glass-epoxy sub-
strate. Two 0.1uF decoupling capacitors are mounted on the
printed circuit board in parallel for each SDRAM.
Part No.
Max Freq. (Speed)
133MHz (7.5ns@CL=2)
133MHz (7.5ns@CL=3)
100MHz (6.0ns@CL=2)
100MHz (6.0ns@CL=3)
M366S3253DTS-L7C/C7C
M366S3253DTS-L7A/C7A
M366S3253DTS-L1H/C1H
M366S3253DTS-L1L/C1L
• Burst mode operation
The M366S325DCTS is a Dual In-line Memory Module and is
intended for mounting into 168-pin edge connector sockets.
Synchronous design allows precise cycle control with the use of
system clock. I/O transactions are possible on every clock cycle.
Range of operating frequencies, programmable latencies allows
the same device to be useful for a variety of high bandwidth, high
performance memory system applications.
• Auto & self refresh capability (8192 Cycles/64ms)
• LVTTL compatible inputs and outputs
• Single 3.3V ± 0.3V power supply
• MRS cycle with address key programs
Latency (Access from column address)
Burst length (1, 2, 4, 8 & Full page)
Data scramble (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the
system clock
• Serial presence detect with EEPROM
• PCB : Height (1,375mil), single sided component
PIN CONFIGURATIONS (Front side/back side)
PIN NAMES
Pin
Pin Front Pin Front
Front Pin Back Pin Back Pin Back
Pin Name
A0 ~ A12
BA0 ~ BA1
DQ0 ~ DQ63
CLK0, CLK2
CKE0
Function
Address input (Multiplexed)
Select bank
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
1
2
3
4
5
6
7
8
9
VSS
29 DQM1
DQ18 85
DQ19 86 DQ32 114 *CS1 142 DQ51
87 DQ33 115 RAS 143 VDD
DQ20 88 DQ34 116 VSS 144 DQ52
VSS 113 DQM5 141 DQ50
DQ0 30
DQ1 31
DQ2 32
DQ3 33
CS0
DU
VSS
A0
Data input/output
Clock input
VDD
NC
*VREF 90
*CKE1 91 DQ36 119
92 DQ37 120
DQ21 93 DQ38 121
89 DQ35 117
A1
A3
A5
A7
A9
145 NC
146 *VREF
147 NC
148 VSS
149 DQ53
Clock enable input
Chip select input
Row address strobe
Column address strobe
Write enable
VDD
34
A2
VDD 118
CS0, CS2
RAS
DQ4 35
DQ5 36
DQ6 37
A4
A6
A8
VSS
CAS
10 DQ7 38 A10/AP
DQ22 94 DQ39 122 BA0 150 DQ54
DQ23 95 DQ40 123 A11 151 DQ55
WE
11 DQ8 39
12 40
13 DQ9 41
BA1
VDD
VDD
DQM0 ~ 7
VDD
DQM
VSS
VSS
96
VSS 124 VDD 152 VSS
DQ24 97 DQ41 125 *CLK1 153 DQ56
DQ25 98 DQ42 126 A12 154 DQ57
DQ26 99 DQ43 127 VSS 155 DQ58
DQ27 100 DQ44 128 CKE0 156 DQ59
VDD 101 DQ45 129 *CS3 157 VDD
DQ28 102 VDD 130 DQM6 158 DQ60
DQ29 103 DQ46 131 DQM7 159 DQ61
DQ30 104 DQ47 132 *A13 160 DQ62
DQ31 105 *CB4 133 VDD 161 DQ63
Power supply (3.3V)
Ground
14 DQ10 42 CLK0
VSS
15 DQ11 43
16 DQ12 44
17 DQ13 45
VSS
DU
CS2
*VREF
Power supply for reference
Serial data I/O
SDA
18
VDD
46 DQM2
SCL
Serial clock
19 DQ14 47 DQM3
SA0 ~ 2
*WP
Address in EEPROM
Write protection
Don¢t use
20 DQ15 48
21 *CB0 49
22 *CB1 50
DU
VDD
NC
NC
VSS 106 *CB5 134
CLK2 107 VSS 135
NC 162 VSS
NC 163 *CLK3
DU
23
24
25
26
27
VSS
NC
NC
VDD
WE
51
NC
No connection
52 *CB2
53 *CB3
54
NC 108 NC 136 *CB6 164 NC
*WP 109 NC 137 *CB7 165 **SA0
**SDA 110 VDD 138 VSS 166 **SA1
*
These pins are not used in this module.
** These pins should be NC in the system
VSS
55 DQ16 83 **SCL 111 CAS 139 DQ48 167 **SA2
84
which does not support SPD.
28 DQM0 56 DQ17
VDD 112 DQM4 140 DQ49 168 VDD
SAMSUNG ELECTRONICS CO., Ltd. reserves the right to change products and specifications without notice.
REV. 0.0 Jan. 2002